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Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications

Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications

MOQ: 1pcs
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 1か月あたり5000pcs
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-052.V1.0
基本材料:
TP600
レイヤーカウント:
2層
PCBの厚さ:
5.1mm
PCBサイズ:
25mm×25mm±0.15mm
銅重量:
1オンス(1.4ミルまたは35μmに相当)
表面仕上げ:
エレクトロレスニッケルイマージョンゴールド(enig)
ハイライト:

TP600 RF PCB Board

,

5.1mm RF PCB Board

,

25mm × 25mm RF PCB Board

製品説明
Double-Sided TP600 PCB 1OZ Copper RF Printed Circuit Board

This PCB is a high-reliability double-sided (2-layer) rigid printed circuit board meticulously crafted from TP600 material. TP600 is a distinctive thermoplastic high-frequency composite, blending ceramics with polyphenylene oxide (PPO) resin, and notably, it lacks fiberglass reinforcement. Tailored for high-precision high-frequency applications, the board capitalizes on TP600's stable dielectric performance, minimal signal loss, and adaptable characteristics. These features enable it to satisfy the stringent demands of industries such as navigation, aerospace, and miniaturized antenna systems.

PCB Specifications
Parameter Technical Details
Base Material TP600 (ceramic-PPO resin thermoplastic, no fiberglass reinforcement)
Layer Count Double-sided (2-layer) rigid configuration
Board Dimensions 25mm × 25mm ±0.15mm
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.7mm
Finished Board Thickness 5.1mm
Finished Copper Weight 1oz (35μm) for outer layers (top and bottom)
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen No silkscreen on top or bottom layers
Solder Mask No solder mask on top or bottom layers
Quality Assurance 100% electrical testing (continuity, isolation)
PCB Stack-up Configuration
Layer Sequence Material/Component Thickness
1 Copper Layer 1 (Top) 35μm
2 TP600 Core 5.08mm (200mil)
3 Copper Layer 2 (Bottom) 35μm
TP Series Material Overview

TP series materials are industry-unique high-frequency thermoplastics, distinguished by their ceramic-PPO resin composition (no fiberglass reinforcement) and customizable dielectric properties:

Composition: Ceramic fillers blended with PPO resin; Dk can be precisely adjusted (3.0-25.0) by modifying the ceramic-to-PPO ratio, making the series adaptable to diverse high-frequency needs.

Product Differentiation: TP (unclad smooth surface), TP-1 (single-sided copper-clad), TP-2 (double-sided copper-clad); this PCB uses TP600 (Dk=6.0) in a double-sided configuration.

Key Advantages: Excellent dielectric stability, low moisture absorption, and UL 94-V0 flammability rating--critical for reliability in aerospace, defense, and navigation applications.

Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications 0
TP600 Key Features

TP600, the base material of this PCB, delivers targeted performance features for high-reliability high-frequency scenarios:

Precise Dielectric Constant

Dk=6.0±0.12 at 10GHz, ensuring minimal variation across the board and consistent signal propagation in frequency-sensitive circuits (e.g., satellite navigation).

Ultra-Low Dissipation Factor

0.0010 at 10GHz, minimizing signal attenuation even in high-frequency applications, preserving signal integrity for long-distance or low-power transmissions.

Stable Temperature Coefficient of Dk (TCDk)

-50 ppm/°C over -55°C to 150°C, maintaining dielectric performance across extreme temperature ranges--essential for aerospace (e.g., missile-borne) and outdoor navigation systems.

Controlled Thermal Expansion

CTE of 50 ppm/°C (X-axis), 50 ppm/°C (Y-axis), and 60 ppm/°C (Z-axis) over -55°C to 150°C, reducing mechanical stress during thermal cycling and preventing trace warpage.

Efficient Thermal Conductivity

0.55 W/mk, facilitating heat dissipation from active components (e.g., navigation chips) in compact, enclosed designs.

Minimal Moisture Absorption

0.01%, preventing dielectric degradation and Dk drift in humid or harsh environments--critical for long-term reliability in outdoor or aerospace applications.

Flammability Compliance

UL 94-V0 rated, meeting safety requirements for mission-critical systems (e.g., aircraft navigation, defense electronics).

Manufacturing and Quality Standards

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines) and global production chains.

Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial and industrial high-frequency applications with strict controls for trace width accuracy, hole precision, and electrical continuity.

Processing Adaptability: TP600's thermoplastic nature enables compatibility with standard PCB manufacturing processes (e.g., etching, plating), eliminating the need for specialized equipment and reducing production costs.

Availability

This PCB is available for worldwide shipping, meeting global project requirements--from aerospace and defense to industrial navigation systems.

Typical Applications:
  • Global Satellite Navigation System
  • Missile-borne electronics
  • Fuze technology
  • Miniaturized antenna systems
Conclusion

The double-sided TP600 PCB combines the material's unique ceramic-PPO composition (stable Dk, low loss) with precision manufacturing to address the demands of compact, high-reliability high-frequency applications. Its ultra-compact size, mechanical robustness, and compliance with strict quality standards make it an optimal solution for mission-critical systems like satellite navigation, missile-borne electronics, and miniaturized antennas.

Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications 1
製品
商品の詳細
Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications
MOQ: 1pcs
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 1か月あたり5000pcs
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-052.V1.0
基本材料:
TP600
レイヤーカウント:
2層
PCBの厚さ:
5.1mm
PCBサイズ:
25mm×25mm±0.15mm
銅重量:
1オンス(1.4ミルまたは35μmに相当)
表面仕上げ:
エレクトロレスニッケルイマージョンゴールド(enig)
最小注文数量:
1pcs
価格:
USD9.99-99.99
パッケージの詳細:
真空バッグ+カートン
受渡し時間:
8-9営業日
支払条件:
T/T
供給の能力:
1か月あたり5000pcs
ハイライト

TP600 RF PCB Board

,

5.1mm RF PCB Board

,

25mm × 25mm RF PCB Board

製品説明
Double-Sided TP600 PCB 1OZ Copper RF Printed Circuit Board

This PCB is a high-reliability double-sided (2-layer) rigid printed circuit board meticulously crafted from TP600 material. TP600 is a distinctive thermoplastic high-frequency composite, blending ceramics with polyphenylene oxide (PPO) resin, and notably, it lacks fiberglass reinforcement. Tailored for high-precision high-frequency applications, the board capitalizes on TP600's stable dielectric performance, minimal signal loss, and adaptable characteristics. These features enable it to satisfy the stringent demands of industries such as navigation, aerospace, and miniaturized antenna systems.

PCB Specifications
Parameter Technical Details
Base Material TP600 (ceramic-PPO resin thermoplastic, no fiberglass reinforcement)
Layer Count Double-sided (2-layer) rigid configuration
Board Dimensions 25mm × 25mm ±0.15mm
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.7mm
Finished Board Thickness 5.1mm
Finished Copper Weight 1oz (35μm) for outer layers (top and bottom)
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Silkscreen No silkscreen on top or bottom layers
Solder Mask No solder mask on top or bottom layers
Quality Assurance 100% electrical testing (continuity, isolation)
PCB Stack-up Configuration
Layer Sequence Material/Component Thickness
1 Copper Layer 1 (Top) 35μm
2 TP600 Core 5.08mm (200mil)
3 Copper Layer 2 (Bottom) 35μm
TP Series Material Overview

TP series materials are industry-unique high-frequency thermoplastics, distinguished by their ceramic-PPO resin composition (no fiberglass reinforcement) and customizable dielectric properties:

Composition: Ceramic fillers blended with PPO resin; Dk can be precisely adjusted (3.0-25.0) by modifying the ceramic-to-PPO ratio, making the series adaptable to diverse high-frequency needs.

Product Differentiation: TP (unclad smooth surface), TP-1 (single-sided copper-clad), TP-2 (double-sided copper-clad); this PCB uses TP600 (Dk=6.0) in a double-sided configuration.

Key Advantages: Excellent dielectric stability, low moisture absorption, and UL 94-V0 flammability rating--critical for reliability in aerospace, defense, and navigation applications.

Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications 0
TP600 Key Features

TP600, the base material of this PCB, delivers targeted performance features for high-reliability high-frequency scenarios:

Precise Dielectric Constant

Dk=6.0±0.12 at 10GHz, ensuring minimal variation across the board and consistent signal propagation in frequency-sensitive circuits (e.g., satellite navigation).

Ultra-Low Dissipation Factor

0.0010 at 10GHz, minimizing signal attenuation even in high-frequency applications, preserving signal integrity for long-distance or low-power transmissions.

Stable Temperature Coefficient of Dk (TCDk)

-50 ppm/°C over -55°C to 150°C, maintaining dielectric performance across extreme temperature ranges--essential for aerospace (e.g., missile-borne) and outdoor navigation systems.

Controlled Thermal Expansion

CTE of 50 ppm/°C (X-axis), 50 ppm/°C (Y-axis), and 60 ppm/°C (Z-axis) over -55°C to 150°C, reducing mechanical stress during thermal cycling and preventing trace warpage.

Efficient Thermal Conductivity

0.55 W/mk, facilitating heat dissipation from active components (e.g., navigation chips) in compact, enclosed designs.

Minimal Moisture Absorption

0.01%, preventing dielectric degradation and Dk drift in humid or harsh environments--critical for long-term reliability in outdoor or aerospace applications.

Flammability Compliance

UL 94-V0 rated, meeting safety requirements for mission-critical systems (e.g., aircraft navigation, defense electronics).

Manufacturing and Quality Standards

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines) and global production chains.

Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial and industrial high-frequency applications with strict controls for trace width accuracy, hole precision, and electrical continuity.

Processing Adaptability: TP600's thermoplastic nature enables compatibility with standard PCB manufacturing processes (e.g., etching, plating), eliminating the need for specialized equipment and reducing production costs.

Availability

This PCB is available for worldwide shipping, meeting global project requirements--from aerospace and defense to industrial navigation systems.

Typical Applications:
  • Global Satellite Navigation System
  • Missile-borne electronics
  • Fuze technology
  • Miniaturized antenna systems
Conclusion

The double-sided TP600 PCB combines the material's unique ceramic-PPO composition (stable Dk, low loss) with precision manufacturing to address the demands of compact, high-reliability high-frequency applications. Its ultra-compact size, mechanical robustness, and compliance with strict quality standards make it an optimal solution for mission-critical systems like satellite navigation, missile-borne electronics, and miniaturized antennas.

Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for High Frequency Applications 1
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