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0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish

認証
中国 Bicheng Electronics Technology Co., Ltd 認証
中国 Bicheng Electronics Technology Co., Ltd 認証
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オンラインです

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish
0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish

大画像 :  0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish

商品の詳細:
起源の場所: 中国
ブランド名: Bicheng
証明: UL, ISO9001, IATF16949
モデル番号: BIC-052.V1.0
お支払配送条件:
最小注文数量: 1pcs
価格: USD9.99-99.99
パッケージの詳細: 真空バッグ+カートン
受渡し時間: 8-9営業日
支払条件: T/T
供給の能力: 1か月あたり5000pcs

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish

説明
基本材料: TLX-0 レイヤーカウント: 2層
PCBの厚さ: 0.6mm PCBサイズ: 175mm×90mm
銅重量: 1オンス(1.4ミルまたは35μmに相当) 表面仕上げ: 浸漬ゴールド
ハイライト:

0.6mm TLX-0 PCB board

,

double-sided immersion gold PCB

,

RF PCB with gold finish

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish

This 2-layer rigid PCB caters to versatile RF and microwave applications, utilizing TLX-0—a PTFE fiberglass composite—to offer stable electrical performance and outstanding resilience in harsh environments (e.g., vibration, extreme temperatures, radiation). Every construction detail, from material selection to hole treatment, is optimized for low-layer-count microwave designs, ensuring reliability across use cases like radar systems and mobile communications. Key specifications are as follows:

 

1. PCB Specifications

Parameter Details
Base Material TLX-0
Layer Count 2-layer (rigid structure)
Board Dimensions 175mm x 90mm per piece (10PCS total), with a dimensional tolerance of ±0.15mm
Minimum Trace/Space 5 mils (trace) / 7 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Hole Treatment Holes plugged by green solder mask ink
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (1.4 mils) for both outer layers
Surface Finish Immersion Gold
Silkscreen No
Solder Mask No
Quality Assurance 100% electrical testing conducted prior to shipment

 

2. PCB Stack-up Configuration

Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Core Layer TLX-0 0.508mm (20mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)

 

3. Quality & Global Compliance

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2 compliant

 

Availability: Globally accessible

 

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish 0

 

4. Rogers TLX-0 Material Introduction

TLX-0 is a flagship material in the TLX series—PTFE fiberglass composites engineered as "workhorses" for the RF/microwave substrate world. Its core strength lies in versatility and environmental resilience.

 

TLX-0 stands out for its tight dielectric constant (Dk) control: 2.45 ± 0.04, making it ideal for low-layer-count microwave designs where signal predictability is critical. Its PTFE fiberglass composition balances mechanical reinforcement (via fiberglass) with the low-loss electrical properties of PTFE, eliminating the need for complex multi-layer structures in many RF applications.

 

5. TLX-0 Key Features

The material’s features are tailored to address RF/microwave challenges—from signal stability to environmental durability:

Feature Specification
Dielectric Constant (Dk) 2.45 ± 0.04 at 10GHz
Dissipation Factor (DF) 0.0021 at 10GHz
Moisture Absorption 0.02%
Coefficient of Thermal Expansion (CTE) X-axis: 21 ppm/°C; Y-axis: 23 ppm/°C; Z-axis: 215 ppm/°C
Peel Strength 12 lbs/in (ensures strong copper-to-substrate bonding)
Flammability Rating UL 94 V0

 

6. Material Benefits

TLX-0’s properties translate to tangible advantages for the PCB, solving key pain points in RF/microwave design and harsh-environment operation:

 

-Exceptional Signal Quality: Low DF (0.0021 at 10GHz) and tightly controlled Dk (2.45 ± 0.04) minimize signal loss and ensure predictable impedance—critical for couplers, splitters, and amplifiers.

 

-Superior Passive Intermodulation (PIM) Performance: Measures lower than -160 dBc, eliminating signal distortion in high-power RF systems (e.g., radar, mobile base stations).

 

-Environmental Resilience: Fiberglass reinforcement resists creep (vibration stability), low moisture absorption (0.02%) prevents performance degradation in humid/marine settings, and radiation resistance suits space applications (per NASA’s low-outgassing standards).

 

-Mechanical Durability: High peel strength (12 lbs/in) ensures long-term copper bonding, even under thermal cycling or physical stress.

 

-Safety & Compliance: UL 94 V0 flammability rating meets global safety standards for electronic equipment in enclosed or high-risk environments.

 

7. Typical Applications

Leveraging its versatility, environmental resilience, and stable RF performance, this PCB is ideally suited for:

 

-RF/Microwave Components: Couplers, splitters, combiners, amplifiers, antennas, and passive components.

 

-Radar Systems: Ground-based, airborne, or marine radar (resists vibration and temperature extremes).

 

-Mobile Communications: Infrastructure for 4G/5G networks (low signal loss and PIM performance).

 

-Test & Measurement: Microwave test equipment (requires precise signal integrity).

 

-Specialized Environments: Space applications (radiation resistance, low outgassing), warship antennas (saltwater resilience), and engine-module electronics (high-temperature tolerance).

 

-Transmission Devices: Microwave transmission equipment for long-range data/signal transfer.

 

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish 1

連絡先の詳細
Bicheng Electronics Technology Co., Ltd

コンタクトパーソン: Ms. Ivy Deng

電話番号: 86-755-27374946

ファックス: 86-755-27374848

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