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Double-layer Taconic TLY-3 PCB 20mil Laminate

Double-layer Taconic TLY-3 PCB 20mil Laminate

MOQ: 1pcs
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 1か月あたり5000pcs
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-052.V1.0
基本材料:
タコニック TLY-3
レイヤーカウント:
2層
PCBの厚さ:
0.6mm
PCBサイズ:
125mm×47mm(±0.15mm)
銅重量:
外層に 1 オンス (1.4 ミル)
表面仕上げ:
シルバープレート/ゴールドプレート(シルバーの上に金)
ハイライト:

Double-layer RF PCB board

,

Taconic TLY-3 PCB laminate

,

20mil RF PCB board

製品説明
Double-layer Taconic TLY-3 PCB 20mil Laminate

This 2-layer rigid PCB is built around Taconic TLY-3, a high-performance laminate featuring lightweight woven fiberglass. Renowned for exceptional dimensional stability, ultra-low dissipation factor, and consistent dielectric properties, TLY-3 makes this PCB a standout choice for demanding applications—from automotive radar (77 GHz) to satellite communications and aerospace systems.

 

1. PCB Specifications

Parameter Specification
Base Material Taconic TLY-3 (woven fiberglass-reinforced PTFE)
Layer Count 2-layer (no blind vias)
Board Dimensions 125mm x 47mm (±0.15mm)
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (35μm per outer layer)
Via Plating Thickness 20μm
Surface Finish Silver plate with gold over silver
Silkscreen (Top/Bottom) No / No
Solder Mask (Top/Bottom) No / No
Quality Testing 100% electrical test pre-shipment

 

2. PCB Stack-up

Layer/Component Specification
Copper Layer 1 35μm (1oz)
Taconic TLY-3 Core 20mil (0.508mm)
Copper Layer 2 35μm (1oz)

 

3. Artwork Format, Quality Standards & Availability

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Global Availability: Supplied worldwide

 

Double-layer Taconic TLY-3 PCB 20mil Laminate 0

 

4. TLY-3 Material: Overview & Key Features

Taconic TLY-3 is a woven fiberglass-reinforced PTFE laminate engineered to address the most demanding high-frequency and high-reliability requirements. Unlike chopped fiber PTFE composites, its woven matrix delivers superior dimensional stability—making it ideal for high-volume manufacturing (where consistency reduces waste and boosts yields).

 

A key advantage of TLY-3 is its performance at millimeter-wave frequencies: OEM testing at 77 GHz (critical for automotive radar) shows it matches the insertion loss and dielectric properties of competing chopped fiber materials, while delivering higher manufacturing yields (a major cost-saving benefit).

 

Below are TLY-3’s critical technical features (measured at 10 GHz unless noted):

Feature Specification
Dielectric Constant (Dk) 2.33 ± 0.02 (uniform and consistent)
Dissipation Factor (Df) 0.0012 (ultra-low for minimal signal loss)
Thermal Conductivity 0.22 W/mK (unclad, efficient heat transfer)
CTE (x/y/z) 26 ppm/°C / 15 ppm/°C / 217 ppm/°C
Peel Strength (1oz Cu) 17 lbs/in (strong bond between copper and substrate)
Moisture Absorption 0.02% (near-zero, preventing performance degradation from humidity)
Flammability Rating UL 94 V-0 (flame-retardant, safe for automotive/aerospace use)
Outgassing (TML/CVCM/WVR) 0.01% / 0.01% / 0.01% (meets strict aerospace outgassing requirements)
Laser Ablatability Yes (enables precise, high-resolution fabrication for complex designs)

 

5. Core Benefits of the TLY-3 PCB

This PCB leverages TLY-3’s inherent advantages to solve key challenges in high-frequency and high-reliability applications:

 

Superior Dimensional Stability: Woven fiberglass matrix eliminates warpage or shrinkage during manufacturing, boosting yields and ensuring consistent fit in assemblies.

 

Ultra-Low Dissipation Factor (0.0012): Minimizes signal loss at high frequencies (e.g., 77 GHz automotive radar, Ka-band satellite communications), preserving data integrity.

 

Consistent Dielectric Constant (±0.02): Ensures predictable signal behavior across the PCB, critical for precision components like filters and couplers.

 

High Peel Strength (17 lbs/in for 1oz Cu): Reinforces the bond between copper layers and the TLY-3 core, preventing delamination under thermal stress (e.g., automotive temperature cycles).

 

Near-Zero Moisture Absorption (0.02%): Protects performance in humid environments (e.g., aerospace or outdoor telecommunications), avoiding dielectric breakdown or signal degradation.

 

Laser Ablatability: Enables high-precision fabrication of fine features, supporting miniaturized designs for space-constrained applications.

 

6. Typical Applications

Automotive Radar: Optimized for 77 GHz systems (adaptive cruise control, collision avoidance), with low signal loss and dimensional stability to withstand automotive temperature cycles.

 

Satellite/Cellular Communications: Performs reliably in Ka, E, and W band frequencies, supporting high-speed data transfer for satellite links and 5G/6G infrastructure.

 

Aerospace & Avionics: Meets strict outgassing and flame-retardant standards (UL 94 V-0), suitable for in-cabin electronics and radar systems.

 

High-Frequency Amplifiers & Receivers: Ideal for Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs), where low Df preserves signal quality.

 

Precision Passive Components: Supports filters, couplers, and phase shifters, thanks to TLY-3’s consistent Dk and low moisture absorption.

 

Conclusion

This 2-layer PCB with Taconic TLY-3 material represents a perfect blend of precision, performance, and reliability. Its tight manufacturing tolerances (e.g., ±0.15mm dimensions, 4/6 mil trace/space), industry-standard quality (IPC-Class-2), and TLY-3’s ultra-low Df and dimensional stability make it a trusted solution for high-frequency and high-reliability applications.

 

Double-layer Taconic TLY-3 PCB 20mil Laminate 1

製品
商品の詳細
Double-layer Taconic TLY-3 PCB 20mil Laminate
MOQ: 1pcs
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 1か月あたり5000pcs
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-052.V1.0
基本材料:
タコニック TLY-3
レイヤーカウント:
2層
PCBの厚さ:
0.6mm
PCBサイズ:
125mm×47mm(±0.15mm)
銅重量:
外層に 1 オンス (1.4 ミル)
表面仕上げ:
シルバープレート/ゴールドプレート(シルバーの上に金)
最小注文数量:
1pcs
価格:
USD9.99-99.99
パッケージの詳細:
真空バッグ+カートン
受渡し時間:
8-9営業日
支払条件:
T/T
供給の能力:
1か月あたり5000pcs
ハイライト

Double-layer RF PCB board

,

Taconic TLY-3 PCB laminate

,

20mil RF PCB board

製品説明
Double-layer Taconic TLY-3 PCB 20mil Laminate

This 2-layer rigid PCB is built around Taconic TLY-3, a high-performance laminate featuring lightweight woven fiberglass. Renowned for exceptional dimensional stability, ultra-low dissipation factor, and consistent dielectric properties, TLY-3 makes this PCB a standout choice for demanding applications—from automotive radar (77 GHz) to satellite communications and aerospace systems.

 

1. PCB Specifications

Parameter Specification
Base Material Taconic TLY-3 (woven fiberglass-reinforced PTFE)
Layer Count 2-layer (no blind vias)
Board Dimensions 125mm x 47mm (±0.15mm)
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (35μm per outer layer)
Via Plating Thickness 20μm
Surface Finish Silver plate with gold over silver
Silkscreen (Top/Bottom) No / No
Solder Mask (Top/Bottom) No / No
Quality Testing 100% electrical test pre-shipment

 

2. PCB Stack-up

Layer/Component Specification
Copper Layer 1 35μm (1oz)
Taconic TLY-3 Core 20mil (0.508mm)
Copper Layer 2 35μm (1oz)

 

3. Artwork Format, Quality Standards & Availability

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Global Availability: Supplied worldwide

 

Double-layer Taconic TLY-3 PCB 20mil Laminate 0

 

4. TLY-3 Material: Overview & Key Features

Taconic TLY-3 is a woven fiberglass-reinforced PTFE laminate engineered to address the most demanding high-frequency and high-reliability requirements. Unlike chopped fiber PTFE composites, its woven matrix delivers superior dimensional stability—making it ideal for high-volume manufacturing (where consistency reduces waste and boosts yields).

 

A key advantage of TLY-3 is its performance at millimeter-wave frequencies: OEM testing at 77 GHz (critical for automotive radar) shows it matches the insertion loss and dielectric properties of competing chopped fiber materials, while delivering higher manufacturing yields (a major cost-saving benefit).

 

Below are TLY-3’s critical technical features (measured at 10 GHz unless noted):

Feature Specification
Dielectric Constant (Dk) 2.33 ± 0.02 (uniform and consistent)
Dissipation Factor (Df) 0.0012 (ultra-low for minimal signal loss)
Thermal Conductivity 0.22 W/mK (unclad, efficient heat transfer)
CTE (x/y/z) 26 ppm/°C / 15 ppm/°C / 217 ppm/°C
Peel Strength (1oz Cu) 17 lbs/in (strong bond between copper and substrate)
Moisture Absorption 0.02% (near-zero, preventing performance degradation from humidity)
Flammability Rating UL 94 V-0 (flame-retardant, safe for automotive/aerospace use)
Outgassing (TML/CVCM/WVR) 0.01% / 0.01% / 0.01% (meets strict aerospace outgassing requirements)
Laser Ablatability Yes (enables precise, high-resolution fabrication for complex designs)

 

5. Core Benefits of the TLY-3 PCB

This PCB leverages TLY-3’s inherent advantages to solve key challenges in high-frequency and high-reliability applications:

 

Superior Dimensional Stability: Woven fiberglass matrix eliminates warpage or shrinkage during manufacturing, boosting yields and ensuring consistent fit in assemblies.

 

Ultra-Low Dissipation Factor (0.0012): Minimizes signal loss at high frequencies (e.g., 77 GHz automotive radar, Ka-band satellite communications), preserving data integrity.

 

Consistent Dielectric Constant (±0.02): Ensures predictable signal behavior across the PCB, critical for precision components like filters and couplers.

 

High Peel Strength (17 lbs/in for 1oz Cu): Reinforces the bond between copper layers and the TLY-3 core, preventing delamination under thermal stress (e.g., automotive temperature cycles).

 

Near-Zero Moisture Absorption (0.02%): Protects performance in humid environments (e.g., aerospace or outdoor telecommunications), avoiding dielectric breakdown or signal degradation.

 

Laser Ablatability: Enables high-precision fabrication of fine features, supporting miniaturized designs for space-constrained applications.

 

6. Typical Applications

Automotive Radar: Optimized for 77 GHz systems (adaptive cruise control, collision avoidance), with low signal loss and dimensional stability to withstand automotive temperature cycles.

 

Satellite/Cellular Communications: Performs reliably in Ka, E, and W band frequencies, supporting high-speed data transfer for satellite links and 5G/6G infrastructure.

 

Aerospace & Avionics: Meets strict outgassing and flame-retardant standards (UL 94 V-0), suitable for in-cabin electronics and radar systems.

 

High-Frequency Amplifiers & Receivers: Ideal for Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs), where low Df preserves signal quality.

 

Precision Passive Components: Supports filters, couplers, and phase shifters, thanks to TLY-3’s consistent Dk and low moisture absorption.

 

Conclusion

This 2-layer PCB with Taconic TLY-3 material represents a perfect blend of precision, performance, and reliability. Its tight manufacturing tolerances (e.g., ±0.15mm dimensions, 4/6 mil trace/space), industry-standard quality (IPC-Class-2), and TLY-3’s ultra-low Df and dimensional stability make it a trusted solution for high-frequency and high-reliability applications.

 

Double-layer Taconic TLY-3 PCB 20mil Laminate 1

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