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50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

認証
中国 Bicheng Electronics Technology Co., Ltd 認証
中国 Bicheng Electronics Technology Co., Ltd 認証
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オンラインです

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish
50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

大画像 :  50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

商品の詳細:
起源の場所: 中国
ブランド名: Bicheng
証明: UL, ISO9001, IATF16949
モデル番号: BIC-052.V1.0
お支払配送条件:
最小注文数量: 1pcs
価格: USD9.99-99.99
パッケージの詳細: 真空バッグ+カートン
受渡し時間: 8-9営業日
支払条件: T/T
供給の能力: 1か月あたり5000pcs

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

説明
基本材料: タコニック TLX-9 レイヤーカウント: 2層
PCBの厚さ: 1.35mm PCBサイズ: 57mm×136mm(公差:±0.15mm)
銅重量: 外層に 1 オンス (1.4 ミル) 表面仕上げ: 浸漬ブリキ
ハイライト:

Taconic TLX-9 RF PCB

,

2-layer immersion tin PCB

,

50mil Taconic PCB board

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical.

 

1. PCB Specifications

This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:

Parameter Specification
Base Material Taconic TLX-9 (PTFE/woven glass composite)
Layer Configuration 2 outer layers (no blind vias)
Dimensions 57mm x 136mm per unit (tolerance: ±0.15mm)
Trace/Space Minimum 6/6 mils (ensuring signal integrity in dense layouts)
Minimum Hole Size 0.3mm (supports compact component mounting)
Finished Thickness 1.35mm (balanced rigidity and versatility)
Copper Weight 1oz (1.4 mils) on outer layers (35μm per copper layer)
Via Plating 20μm thickness (enhances conductivity and durability)
Surface Finish Immersion tin (corrosion resistance and solderability)
Silkscreen & Solder Mask White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs)
Quality Assurance Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications)

 

2. PCB Stack-up

Layer/Component Specification
Copper Layer 1 35μm
Taconic TLX-9 Core 1.27mm (50mil)
Copper Layer 2 35μm

 

3. Artwork & Quality Standards

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)

 

Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)

 

Global Availability: Supplied worldwide to support international project requirements

 

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 0

 

4. TLX-9 Material: Overview & Key Properties

Taconic TLX-9 is a PTFE/woven glass laminate engineered for precision electronics, offering exceptional processability (shearing, drilling, milling, plating) using standard PTFE fabrication methods. Its dimensional stability and near-zero moisture absorption (<0.02%) during manufacturing make it ideal for high-reliability applications. Below are its critical technical properties (measured at 10 GHz unless noted):

Property Specification
Dielectric Constant (DK) 2.5 (tightly controlled across frequency/temperature)
Dissipation Factor (DF) 0.0019
Moisture Absorption <0.02%
Dielectric Breakdown >60 kV
Volume Resistivity 10⁷ Mohm/cm
Surface Resistivity 10⁷ Mohm
Arc Resistance >180 seconds
Flexural Strength (Lengthwise) >23,000 lbs./in.
Flexural Strength (Crosswise) >19,000 lbs./in.
Peel Strength (1oz copper) 12 lbs./linear in.
Thermal Conductivity 0.19 W/m/K
x-y CTE 9-12 ppm/°C
z CTE 130-145 ppm/°C
UL-94 Flammability Rating V-0 (flame-retardant)

 

5. Core Benefits of TLX-9 PCB

This PCB leverages TLX-9’s inherent advantages to deliver superior performance:

 

Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.

 

Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.

 

Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.

 

High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.

 

Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.

 

Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.

 

6. Typical Applications

The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:

 

-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)

 

-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems

 

-Large Format Antennas

 

-High Power Amplifiers

 

-Passive Components (resistors, capacitors, inductors) for high-frequency circuits

 

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 1

連絡先の詳細
Bicheng Electronics Technology Co., Ltd

コンタクトパーソン: Ms. Ivy Deng

電話番号: 86-755-27374946

ファックス: 86-755-27374848

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