|
| MOQ: | 1pcs |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空バッグ+カートン |
| 配達期間: | 8-9営業日 |
| 決済方法: | T/T |
| 供給能力: | 1か月あたり5000pcs |
This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace.
1. PCB details
| Parameter | Specification |
| Base Material | M6 High Speed material + High Tg FR-4 (optimized for high-frequency performance) |
| Layer Count | 6 Layers (rigid structure) |
| Board Dimensions | 100mm × 50mm per unit (tolerance: ±0.15mm) |
| Trace/Space (Minimum) | 4 mils (trace) / 5 mils (space) |
| Hole Size (Minimum) | 0.3mm (no blind vias) |
| Finished Board Thickness | 1.0mm |
| Copper Weight | - Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) – ensures excellent solderability, corrosion resistance, and long-term reliability |
| Silkscreen | Top/Bottom Layers: White (high contrast for component identification) |
| Solder Mask | Top/Bottom Layers: Green (protects copper traces, prevents solder bridging) |
| Special Features | - Copper coin embedded in the PCB center (enhances thermal conductivity)- All vias: Resin-filled and capped (prevents solder wicking, improves surface flatness for SMT assembly) |
| Quality Testing | 100% Electrical Test (open/short circuit detection) prior to shipment |
2. PCB Stack-up
| Layer Type | Material Specification | Thickness |
| Top Copper Layer | Electrolytic Copper | 35 μm |
| Core Layer | M6 High Speed Material (R5775G) | 0.25 mm |
| Inner Copper Layer 1 (Inn1) | Electrolytic Copper | 18 μm |
| Prepreg Layer | 1080 Style Prepreg (64% resin content), 2 sheets stacked | 0.14 mm |
| Inner Copper Layer 2 (Inn2) | Electrolytic Copper | 35 μm |
| Core Layer | High Tg FR-4 (IT-180) | 0.1 mm |
| Inner Copper Layer 3 (Inn3) | Electrolytic Copper | 35 μm |
| Prepreg Layer | 1080 Style Prepreg (64% resin content), 2 sheets stacked | 0.14 mm |
| Inner Copper Layer 4 (Inn4) | Electrolytic Copper | 18 μm |
| Core Layer | High Tg FR-4 (IT-180) | 0.1 mm |
| Bottom Copper Layer | Electrolytic Copper | 35 μm |
3. Material Advantages: M6 High Speed Material
The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:
Electrical Performance:
Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).
Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).
Thermal Stability:
High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.
Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.
Mechanical Reliability:
Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).
Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).
Manufacturability & Sustainability:
Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).
Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.
4. Quality & Availability
Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).
Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).
Availability: Worldwide (supports global projects for large-scale production).
5. Typical Applications
This PCB is optimized for high-frequency, high-reliability scenarios, including:
5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).
Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).
Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).
Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).
|
|
| MOQ: | 1pcs |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空バッグ+カートン |
| 配達期間: | 8-9営業日 |
| 決済方法: | T/T |
| 供給能力: | 1か月あたり5000pcs |
This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace.
1. PCB details
| Parameter | Specification |
| Base Material | M6 High Speed material + High Tg FR-4 (optimized for high-frequency performance) |
| Layer Count | 6 Layers (rigid structure) |
| Board Dimensions | 100mm × 50mm per unit (tolerance: ±0.15mm) |
| Trace/Space (Minimum) | 4 mils (trace) / 5 mils (space) |
| Hole Size (Minimum) | 0.3mm (no blind vias) |
| Finished Board Thickness | 1.0mm |
| Copper Weight | - Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) – ensures excellent solderability, corrosion resistance, and long-term reliability |
| Silkscreen | Top/Bottom Layers: White (high contrast for component identification) |
| Solder Mask | Top/Bottom Layers: Green (protects copper traces, prevents solder bridging) |
| Special Features | - Copper coin embedded in the PCB center (enhances thermal conductivity)- All vias: Resin-filled and capped (prevents solder wicking, improves surface flatness for SMT assembly) |
| Quality Testing | 100% Electrical Test (open/short circuit detection) prior to shipment |
2. PCB Stack-up
| Layer Type | Material Specification | Thickness |
| Top Copper Layer | Electrolytic Copper | 35 μm |
| Core Layer | M6 High Speed Material (R5775G) | 0.25 mm |
| Inner Copper Layer 1 (Inn1) | Electrolytic Copper | 18 μm |
| Prepreg Layer | 1080 Style Prepreg (64% resin content), 2 sheets stacked | 0.14 mm |
| Inner Copper Layer 2 (Inn2) | Electrolytic Copper | 35 μm |
| Core Layer | High Tg FR-4 (IT-180) | 0.1 mm |
| Inner Copper Layer 3 (Inn3) | Electrolytic Copper | 35 μm |
| Prepreg Layer | 1080 Style Prepreg (64% resin content), 2 sheets stacked | 0.14 mm |
| Inner Copper Layer 4 (Inn4) | Electrolytic Copper | 18 μm |
| Core Layer | High Tg FR-4 (IT-180) | 0.1 mm |
| Bottom Copper Layer | Electrolytic Copper | 35 μm |
3. Material Advantages: M6 High Speed Material
The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:
Electrical Performance:
Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).
Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).
Thermal Stability:
High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.
Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.
Mechanical Reliability:
Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).
Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).
Manufacturability & Sustainability:
Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).
Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.
4. Quality & Availability
Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).
Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).
Availability: Worldwide (supports global projects for large-scale production).
5. Typical Applications
This PCB is optimized for high-frequency, high-reliability scenarios, including:
5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).
Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).
Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).
Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).
