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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ: 1個
価格: USD9.99-99.99
標準パッケージ: 真空袋+カートン
配達期間: 8~9営業日
決済方法: T/T
供給能力: 5000PCS/月
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-332.V1.0
部品番号:
TLY-3
ラミネートの厚さ:
0.0035インチ; 0.0050インチ; 0.0075インチ; 0.0100インチ
ラミネートサイズ:
12×18インチ(305×457mm); 16 x 36インチ (406 x 914mm); 16 x 18インチ (406 x 457mm); 24 x 36インチ (610 x 914mm); 1
銅の重量:
1/2オンスED銅;1オンスCL1銅;1オンスC1コッペ
ハイライト:

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

製品説明

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
製品
商品の詳細
PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
MOQ: 1個
価格: USD9.99-99.99
標準パッケージ: 真空袋+カートン
配達期間: 8~9営業日
決済方法: T/T
供給能力: 5000PCS/月
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-332.V1.0
部品番号:
TLY-3
ラミネートの厚さ:
0.0035インチ; 0.0050インチ; 0.0075インチ; 0.0100インチ
ラミネートサイズ:
12×18インチ(305×457mm); 16 x 36インチ (406 x 914mm); 16 x 18インチ (406 x 457mm); 24 x 36インチ (610 x 914mm); 1
銅の重量:
1/2オンスED銅;1オンスCL1銅;1オンスC1コッペ
最小注文数量:
1個
価格:
USD9.99-99.99
パッケージの詳細:
真空袋+カートン
受渡し時間:
8~9営業日
支払条件:
T/T
供給の能力:
5000PCS/月
ハイライト

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

製品説明

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
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