|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
Fabricated with AD250C+ TG170 FR-4 as its core materials, this 4-layer hybrid PCB features an Immersion Tin surface finish. Each layer is equipped with a 1oz copper weight, along with a finished board thickness of 1.8mm and a via plating thickness of 20 μm—all of which combine to deliver stable performance and precise manufacturing, making it ideal for high-demand wireless and antenna-related electronic applications.
PCB Specifications
| Specifications | Details |
| Base material | AD250C+ TG170 FR-4 |
| Layer count | 4-layer |
| Board dimensions | 79.6mm x 103.4mm per unit, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 7/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | Not incorporated |
| Finished board thickness | 1.8mm |
| Finished Cu weight | 1oz per layer |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Tin |
| Top Silkscreen | White |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Not applied |
| Bottom Solder Mask | Not applied |
| Quality control | 100% electrical testing conducted prior to shipment |
PCB Stack-up
The 4-layer rigid PCB boasts the following stack-up structure, presented from top to bottom:
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| AD250C substrate | 1.524 mm (60 mil) |
| Copper_layer_2 | 35 μm |
| FR-4 Prepreg | 0.2mm |
| Copper_layer_3 | 35 μm |
| Tg170 FR-4 Core | 0.102 mm (4 mil) |
| Copper_layer_4 | 35 μm |
Artwork Type
For PCB manufacturing purposes, the provided artwork adheres to the Gerber RS-274-X format, which is the industry standard for transmitting PCB fabrication data.
Quality Standard
This PCB complies with the IPC-Class-2 standard, a widely accepted industry benchmark for printed circuit boards. IPC-Class-2 outlines requirements for PCB quality, performance, and reliability, rendering it suitable for most commercial and industrial applications that require consistent performance and moderate reliability.
Availability
This PCB is offered globally. We deliver reliable logistics and shipping services to guarantee timely delivery to customers in various countries and regions, catering to both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global technology firms, we provide consistent supply and professional after-sales support to fulfill diverse market needs.
Introduction to AD250C Base Material
Rogers’ AD250C antenna laminates are high-performance specialty materials specifically engineered to address the requirements of today’s wireless antenna markets. Composed of glass-reinforced, PTFE-based materials, these laminates offer a controlled dielectric constant, low-loss performance, and superior passive intermodulation (PIM) characteristics. The woven glass reinforcement enhances circuit processability, facilitating efficient PCB production with high yields. AD250C antenna materials are available with standard electrodeposited (ED) or reverse-treated ED copper foil options, allowing for selections that help reduce circuit losses and enhance antenna PIM performance.
Key Features of AD250C
| Key Features | Specifications |
| Dielectric Constant (Dk) | 2.5 +/- 0.04 at 10 GHz |
| Dissipation Factor | 0.0013 at 10 GHz |
| Thermal Conductivity | 0.33 W/m/°K |
| Coefficient of Thermal Expansion (CTE) | 47 ppm/°C (X-axis), 29 ppm/°C (Y-axis), 196 ppm/°C (Z-axis) |
| Tg Value | >280 °C |
| Water Absorption | 0.04% |
| Flammability | UL 94 V-0 rated |
Core Benefits
-A low loss tangent (<0.002 at 10 GHz), which ensures superior circuit performance across all typical wireless frequency bands
-A controlled dielectric constant (±0.05), enabling consistent and repeatable circuit performance
-Exceptionally low PIM (-159 dBc at 30 mil, 1900 MHz), delivering outstanding antenna performance and minimizing yield loss associated with PIM-related issues
-Excellent dimensional stability, which ensures repeatable circuit performance and enhances manufacturing yields
Typical Applications
Conclusion
Professionals and organizations working with cellular base station antennas, automotive telematics antennas, and commercial satellite radio antennas—along with research and development institutions and technology enterprises involved in producing wireless and antenna-related equipment—will find this PCB particularly well-suited to their needs. Its global availability, strict pre-shipment electrical testing, and flexible order support effectively meet the specialized high-performance requirements of both regional and global electronic enterprises. Rooted in the high-performance AD250C material, its core advantages make it a reliable, high-performance solution for high-demand wireless electronic applications.
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
Fabricated with AD250C+ TG170 FR-4 as its core materials, this 4-layer hybrid PCB features an Immersion Tin surface finish. Each layer is equipped with a 1oz copper weight, along with a finished board thickness of 1.8mm and a via plating thickness of 20 μm—all of which combine to deliver stable performance and precise manufacturing, making it ideal for high-demand wireless and antenna-related electronic applications.
PCB Specifications
| Specifications | Details |
| Base material | AD250C+ TG170 FR-4 |
| Layer count | 4-layer |
| Board dimensions | 79.6mm x 103.4mm per unit, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 7/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | Not incorporated |
| Finished board thickness | 1.8mm |
| Finished Cu weight | 1oz per layer |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Tin |
| Top Silkscreen | White |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Not applied |
| Bottom Solder Mask | Not applied |
| Quality control | 100% electrical testing conducted prior to shipment |
PCB Stack-up
The 4-layer rigid PCB boasts the following stack-up structure, presented from top to bottom:
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| AD250C substrate | 1.524 mm (60 mil) |
| Copper_layer_2 | 35 μm |
| FR-4 Prepreg | 0.2mm |
| Copper_layer_3 | 35 μm |
| Tg170 FR-4 Core | 0.102 mm (4 mil) |
| Copper_layer_4 | 35 μm |
Artwork Type
For PCB manufacturing purposes, the provided artwork adheres to the Gerber RS-274-X format, which is the industry standard for transmitting PCB fabrication data.
Quality Standard
This PCB complies with the IPC-Class-2 standard, a widely accepted industry benchmark for printed circuit boards. IPC-Class-2 outlines requirements for PCB quality, performance, and reliability, rendering it suitable for most commercial and industrial applications that require consistent performance and moderate reliability.
Availability
This PCB is offered globally. We deliver reliable logistics and shipping services to guarantee timely delivery to customers in various countries and regions, catering to both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global technology firms, we provide consistent supply and professional after-sales support to fulfill diverse market needs.
Introduction to AD250C Base Material
Rogers’ AD250C antenna laminates are high-performance specialty materials specifically engineered to address the requirements of today’s wireless antenna markets. Composed of glass-reinforced, PTFE-based materials, these laminates offer a controlled dielectric constant, low-loss performance, and superior passive intermodulation (PIM) characteristics. The woven glass reinforcement enhances circuit processability, facilitating efficient PCB production with high yields. AD250C antenna materials are available with standard electrodeposited (ED) or reverse-treated ED copper foil options, allowing for selections that help reduce circuit losses and enhance antenna PIM performance.
Key Features of AD250C
| Key Features | Specifications |
| Dielectric Constant (Dk) | 2.5 +/- 0.04 at 10 GHz |
| Dissipation Factor | 0.0013 at 10 GHz |
| Thermal Conductivity | 0.33 W/m/°K |
| Coefficient of Thermal Expansion (CTE) | 47 ppm/°C (X-axis), 29 ppm/°C (Y-axis), 196 ppm/°C (Z-axis) |
| Tg Value | >280 °C |
| Water Absorption | 0.04% |
| Flammability | UL 94 V-0 rated |
Core Benefits
-A low loss tangent (<0.002 at 10 GHz), which ensures superior circuit performance across all typical wireless frequency bands
-A controlled dielectric constant (±0.05), enabling consistent and repeatable circuit performance
-Exceptionally low PIM (-159 dBc at 30 mil, 1900 MHz), delivering outstanding antenna performance and minimizing yield loss associated with PIM-related issues
-Excellent dimensional stability, which ensures repeatable circuit performance and enhances manufacturing yields
Typical Applications
Conclusion
Professionals and organizations working with cellular base station antennas, automotive telematics antennas, and commercial satellite radio antennas—along with research and development institutions and technology enterprises involved in producing wireless and antenna-related equipment—will find this PCB particularly well-suited to their needs. Its global availability, strict pre-shipment electrical testing, and flexible order support effectively meet the specialized high-performance requirements of both regional and global electronic enterprises. Rooted in the high-performance AD250C material, its core advantages make it a reliable, high-performance solution for high-demand wireless electronic applications.
