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| PCB Material: | Rogers 4003C Core - 1.524 mm (60mil) | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 580mm x 410 mm=1PCS, +/- 0.15mm | PCB Thickness: | 1.6mm |
| Copper Weight: | 1oz (1.4 mils) inner/outer layers | Surface Finish: | Electroless Nickel Immersion Gold |
| Solder Mask: | No | Silkscreen: | No |
| ハイライト: | 60mil Laminates PCB,Electroless Nickel Immersion Gold PCB |
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As the demand for high-performance printed circuit boards (PCBs) continues to rise, our newly shipped double-sided PCB, constructed from Rogers RO4003C material, stands out as an exemplary solution for a broad range of applications. Let's delves into its features, specifications, and benefits of our advanced PCB, highlighting its suitability for various industries.
Understanding RO4003C Material
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that combines the best properties of traditional materials. It offers the electrical performance of PTFE materials while maintaining the manufacturability of epoxy/glass laminates. The dielectric constant of 3.38 ± 0.05 at 10 GHz ensures optimal signal integrity, making it ideal for high-frequency applications.
One of the key advantages of RO4003C is its low dissipation factor—0.0027 at 10 GHz and 0.0021 at 2.5 GHz—allowing for minimal signal loss.
This characteristic is particularly beneficial in applications that require precise signal transmission, such as telecommunications and radar systems.
Construction Features
Our PCB features the following specifications:
- Base Material: Rogers RO4003C, ensuring high-performance and reliability.
- Layer Count: A 2-layer design offers flexibility for complex circuit layouts.
- Dimensions: The board measures 580 mm x 410 mm with a tolerance of +/- 0.15 mm, accommodating various applications.
- Finished Thickness: A robust thickness of 1.6 mm enhances durability.
- Copper Weight: 1 oz (1.4 mils) is applied to the outer layers, ensuring effective conductivity.
- Minimum Trace/Space: Fine layouts are supported with a minimum of 6/10 mils, allowing for dense circuit designs.
- Minimum Hole Size: A versatile hole size of 0.3 mm facilitates various component placements.
- Surface Finish: Electroless Nickel Immersion Gold is used, providing excellent solderability and corrosion resistance.
- Electrical Testing: Each board undergoes rigorous 100% electrical testing prior to shipment, ensuring functionality and reliability.
PCB Stackup
The stackup configuration consists of:
- Copper Layer 1: 35 μm
- Rogers 4003C Core: 1.524 mm (60 mil)
- Copper Layer 2: 35 μm
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Key Benefits
Dimensional Stability
The thermal coefficient of expansion (CTE) of RO4003C closely matches that of copper, providing excellent dimensional stability. This characteristic is crucial for maintaining performance in multi-layer board constructions, especially under varying thermal conditions.
Cost-Effectiveness
Processing RO4003C is comparable to standard FR-4 materials, yet it offers superior performance at a fraction of the cost of conventional microwave laminates. This cost-effectiveness makes it an attractive option for manufacturers seeking high-quality PCBs without exceeding budget constraints.
High Performance
Designed for performance-sensitive and high-volume applications, our PCB excels in environments requiring reliability and efficiency. The low moisture absorption rate of 0.06% further enhances the durability of the PCB, making it suitable for challenging conditions.
Typical Applications
This advanced PCB is ideal for a variety of applications:
- Cellular Base Station Antennas and Power Amplifiers:** Ensures reliable signal transmission and reception.
- RF Identification Tags: Supports accurate tracking and identification.
- Automotive Radar and Sensors: Enhances safety and navigation systems in vehicles.
- LNBs for Direct Broadcast Satellites: Provides stable performance in satellite communications.
Conclusion
Our newly shipped double-sided PCB, utilizing Rogers RO4003C material, represents the forefront of PCB technology. With its exceptional electrical performance, excellent thermal stability, and cost-effectiveness, it is poised to meet the evolving demands of the electronics industry. By choosing our PCB, you can expect unparalleled quality and reliability in your electronic designs.
For further inquiries or to place an order, please contact our dedicated sales team. We are committed to providing the ideal solutions for your PCB needs.
コンタクトパーソン: Ms. Ivy Deng
電話番号: 86-755-27374946
ファックス: 86-755-27374848
