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| PCB Material: | TC350 Core - 1.524 mm (60mil) | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 320mm x 80 mm=1PCS, +/- 0.15mm | PCB Thickness: | 1.6mm |
| Copper Weight: | 1oz (1.4 mils) inner/outer layers | Surface Finish: | Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask: | No | Silkscreen: | No |
| ハイライト: | 1.6mm Thickness Double-Sided PCB,TC350 Double-Sided PCB,2OZ Double-Sided PCB |
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In today's fast-paced technological landscape, the demand for high-performance printed circuit boards (PCBs) continues to soar. Our newly shipped TC350 Double-Sided PCB represents a significant advancement in PCB technology, combining robust materials, meticulous design, and rigorous quality standards.
Construction Details
Premium Base Material: TC350
At the core of this PCB is TC350, a high-quality laminate composed of PTFE, ceramic fillers, and woven glass reinforcement. This unique combination offers exceptional thermal conductivity and low insertion loss, making it perfect for applications that demand efficiency and reliability.
Layer Count and Dimensions
This PCB features a double-sided construction, optimizing space while ensuring maximum functionality. With dimensions of 320mm x 80mm (±0.15mm), this board is engineered for versatility across a range of devices. The finished thickness of 1.6mm strikes an ideal balance between durability and performance.
Trace and Hole Specifications
This PCB is designed with a minimum trace and space of 6/6 mils, ensuring fine detail in circuit layouts. With a minimum hole size of 0.3mm and no blind vias, the board maintains structural integrity while accommodating various components.
Copper Layers and Surface Finish
Featuring two copper layers (each 70 μm thick), this PCB offers a finished copper weight of 2 oz on the outer layers. This ensures excellent conductivity and performance. The electroless nickel immersion gold (ENIG) surface finish provides superior protection against oxidation and enhances solderability.
Quanlity Assurance
Each board undergoes a 100% electrical test prior to shipment, ensuring that it meets IPC-Class-2 quality standards. This rigorous testing guarantees reliability and performance, vital for any electronic application.
Technical Features
Dielectric Performance
The TC350 laminate exhibits a dielectric constant (Dk) of 3.5 at multiple frequencies (1MHz, 1.8GHz, and 10GHz), alongside a low dissipation factor of 0.0015 at 1MHz. This performance is critical for minimizing signal loss, especially in RF applications.
Thermal Stability
The board’s coefficients of thermal expansion (CTE) are finely tuned: 7 ppm/°C in the x/y axes and 23 ppm/°C in the z-axis. This thermal stability is essential for maintaining performance under varying conditions, particularly in high-temperature environments.
Moisture Resistance
With a moisture absorption rate of just 0.05%, the TC350 PCB is designed for durability, ensuring that environmental factors do not compromise its performance.
| Typical Properties:TC350 | |||
| Property | Units | Value | Test Merthod |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | － | 3.50 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 3.50 | RESONANT CAVITY |
| @10 GHz | － | 3.50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1 MHz | － | 0.0015 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 0.0018 | RESONANT CAVITY |
| @10 GHz | － | 0.0020 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | － | ||
| TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 1.4x108 | |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2.Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 520 | IPC TM-650 2.4.24.6 |
| 5% | °C | 567 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | IPC TM-650 2.4.18.3 | |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | － | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.72 | ASTM D5470 |
| Specific Heat | J/gK | 0.90 | ASTM D5470 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
Benefits of the TC350 PCB
1. Enhanced Reliability: The combination of TC350 materials and rigorous testing ensures reduced junction temperatures and improved reliability in demanding applications.
2. Superior Heat Management: The high thermal conductivity of TC350 facilitates excellent heat dissipation, making it ideal for power amplifiers and other high-energy devices.
3. Efficient Bandwidth Utilization: With its low insertion loss and excellent dielectric properties, TC350 PCB maximizes bandwidth efficiency, crucial for RF and microwave applications.
4. Robust Design: The absence of blind vias and the careful design of pads and traces ensure structural integrity, enhancing the longevity of the PCB.
Applications
TC350 PCB is suitable for a wide array of applications, including but not limited to:
- Power Amplifiers: Essential for maximizing signal strength in communication devices.
- Filters and Couplers: Used in RF applications to manage frequency signals.
- Tower Mounted Amplifiers (TMA): Enhances signal quality in cellular networks.
- Microwave Combiners and Power Dividers: Critical for efficient signal processing in advanced communication systems.
Conclusion
TC350 PCB stands at the forefront of PCB technology, designed to meet the rigorous demands of modern electronics. With its advanced materials, meticulous construction, and robust testing, it is an ideal choice for engineers and designers seeking reliability and performance in high-power applications.
For more information or to place an order, please contact our dedicated sales team. We are committed to delivering the ideal solutions for your PCB needs.
コンタクトパーソン: Ms. Ivy Deng
電話番号: 86-755-27374946
ファックス: 86-755-27374848
