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Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

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Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

起源の場所

ブランド名

Bicheng

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャースRO3010

レイヤーカウント:

PCBの厚さ:

0.8mm

プリント基板のサイズ:

45mm×65mm（1個）

シルクスクリーン:

はんだマスク:

外層用 1オンス (1.4 ミル)

表面仕上げ:

浸漬ゴールド

ハイライト:

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

製品説明

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

Crafted for precision and reliability, this 2-layer rigid PCB leverages Rogers RO3010--a ceramic-filled PTFE composite material--to deliver exceptional high-frequency performance, dimensional stability, and circuit miniaturization.

PCB Specification

Parameter	Specification
Layer Count	2-layer rigid PCB
Base Material	Rogers RO3010 (ceramic-filled PTFE composite)
Board Dimensions	45mm x 65mm (1 piece)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.3mm
Vias	12 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: Black; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up (Top to Bottom)

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top - L1)	Copper_layer_1	35μm (1oz)
2	Substrate	Rogers RO3010	0.635mm (25mil)
3	Copper Layer (Bottom - L2)	Copper_layer_2	35μm (1oz)

Rogers RO3010 Material Overview

Rogers RO3010 is an advanced circuit material categorized as a ceramic-filled PTFE composite, designed to deliver a high dielectric constant (Dk) with exceptional stability across broad frequencies and environmental conditions. As a competitively priced solution, it combines superior mechanical and electrical performance, simplifying the design of broadband components while enabling circuit miniaturization-- a key advantage for space-constrained applications. Its consistent characteristics make it suitable for a wide range of high-frequency use cases, from automotive radar to satellite communications, while supporting volume manufacturing with cost-effective pricing.

Key Features of Rogers RO3010

Property	Specification
Dielectric Constant (Dk)	10.2 ±0.30 (10GHz/23°C)
Dissipation Factor (Df)	0.0022 (10GHz/23°C)
Coefficient of Thermal Expansion (CTE)	X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C)
Thermal Decomposition Temperature (Td)	>500°C
Thermal Conductivity	0.95 W/mK
Moisture Absorption	0.05%
Operating Temperature Range	-40°C to +85°C
Quality Certification	ISO 9001 Certified

Core Benefits of Rogers RO3010

Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.

Typical Applications

This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:

Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
Global Positioning System (GPS) antennas
Cellular telecommunications systems (power amplifiers, antennas)
Patch antennas for wireless communications
Direct broadcast satellite (DBS) equipment
Cable system datalinks
Remote meter readers
Power backplanes

Compliant with IPC-Class-2 standards and available globally, it is engineered to meet the demands of automotive, telecommunications, and satellite systems, where a high dielectric constant (Dk) and low loss are non-negotiable.

タグ:

製品

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

詳細情報

製品説明

詳細情報

起源の場所

中国

ブランド名

Bicheng

証明

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャースRO3010

レイヤーカウント:

2層

PCBの厚さ:

0.8mm

プリント基板のサイズ:

45mm×65mm（1個）

シルクスクリーン:

黒

はんだマスク:

いいえ

銅重量:

外層用 1オンス (1.4 ミル)

表面仕上げ:

浸漬ゴールド

最小注文数量:

1個

価格:

USD9.99-99.99

パッケージの詳細:

真空バッグ+カートン

受渡し時間:

8-9営業日

支払条件:

T/T

供給の能力:

1か月あたり5000pcs

ハイライト

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

製品説明

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

PCB Specification

Parameter	Specification
Layer Count	2-layer rigid PCB
Base Material	Rogers RO3010 (ceramic-filled PTFE composite)
Board Dimensions	45mm x 65mm (1 piece)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.3mm
Vias	12 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: Black; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up (Top to Bottom)

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top - L1)	Copper_layer_1	35μm (1oz)
2	Substrate	Rogers RO3010	0.635mm (25mil)
3	Copper Layer (Bottom - L2)	Copper_layer_2	35μm (1oz)

Rogers RO3010 Material Overview

Key Features of Rogers RO3010

Property	Specification
Dielectric Constant (Dk)	10.2 ±0.30 (10GHz/23°C)
Dissipation Factor (Df)	0.0022 (10GHz/23°C)
Coefficient of Thermal Expansion (CTE)	X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C)
Thermal Decomposition Temperature (Td)	>500°C
Thermal Conductivity	0.95 W/mK
Moisture Absorption	0.05%
Operating Temperature Range	-40°C to +85°C
Quality Certification	ISO 9001 Certified

Core Benefits of Rogers RO3010

Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.

Typical Applications

This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:

Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
Global Positioning System (GPS) antennas
Cellular telecommunications systems (power amplifiers, antennas)
Patch antennas for wireless communications
Direct broadcast satellite (DBS) equipment
Cable system datalinks
Remote meter readers
Power backplanes

タグ:

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RF PCB板

ロジャースPCB板

PTFE PCB板

高いTg PCB

多層PCB

Taconic PCB

HDI PCB板

高速PCB

インピーダンスはPCBを制御した

適用範囲が広いPCB板

fr4 PCB板

PCBのステンシル

金属の中心PCB

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,