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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

起源の場所

ブランド名

Bicheng

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース TC600

レイヤーカウント:

PCBの厚さ:

0.8mm

プリント基板のサイズ:

112mm×60mm(1本)±0.15mm

シルクスクリーン:

はんだマスク:

外層用 1オンス (1.4 ミル)

表面仕上げ:

電気のないニッケル電気のないパラジウムと浸水金 (ENEPIG)

ハイライト:

Rogers TC600 PCB board

Double-sided ENEPIG PCB

0.8mm Rogers PCB

製品説明

Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

This 2-layer RF PCB is constructed with Rogers TC600--a specialized composite of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. Engineered to deliver exceptional thermal conductivity (for heat management) and low dielectric loss (for signal integrity), it meets IPC-Class-2 standards and is ideal for power-dense, space-constrained applications like amplifiers, antennas, and avionics components.

PCB Specification

Parameter	Details
Base Material	Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement)
Layer Count	Double sided (2-layer rigid PCB)
Board Dimensions	112mm x 60mm (1 piece)±0.15mm
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.3mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils total: 18μm base copper + 17μm plating per layer)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: Green; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer (Top)	18μm base copper + 17μm plating (finished: 1oz / 35μm total)	35 μm (1oz)
Dielectric Layer	Rogers TC600	0.762 mm (30 mils)
Copper Layer (Bottom)	18μm base copper + 17μm plating (finished: 1oz / 35μm total)	35 μm (1oz)

Material Overview: Rogers TC600 Laminates

Rogers TC600 is a advanced composite laminate designed to address two critical challenges in high-frequency and power-dense circuits: thermal management and signal loss. By combining PTFE (for low dielectric loss) with thermally conductive ceramic fillers (for heat transfer) and woven glass reinforcement (for mechanical robustness), TC600 delivers "best-in-class" thermal conductivity while minimizing dielectric and insertion loss. This unique formulation enables PCB size reduction (via higher efficiency), improves power handling, reduces hotspots, and enhances long-term device reliability--making it a top choice for avionics, antennas, and power amplifiers.

Key Material Features

Specification	Value
Material Type	PTFE + thermally conductive ceramic fillers + woven glass reinforcement
Dielectric Constant (Dk)	6.15 at 1.8 MHz and 10 GHz / 23°C
Dissipation Factor (tanδ)	0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C
Thermal Conductivity	1.1 W/mK
Temperature Coefficient of Dielectric Constant (TCDk)	-75 ppm/°C (range: -40°C to 140°C)
Coefficient of Thermal Expansion (CTE)	X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C
Moisture Absorption	0.03%

Core Benefits

Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.

Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling--extending component lifespan.

Low Signal Loss: Ultra-low dielectric loss (0.0017-0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.

Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).

Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.

Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.

Typical Applications

This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:

Power Amplifiers, Filters, and Couplers
Microwave Combiner and Power Divider Boards (Avionics Applications)
Small Footprint Antennas
Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
GPS & Hand-held RFID Reader Antennas

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金属の中心PCB

Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

詳細情報

製品説明

詳細情報

起源の場所

中国

ブランド名

Bicheng

証明

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース TC600

レイヤーカウント:

2層

PCBの厚さ:

0.8mm

プリント基板のサイズ:

112mm×60mm(1本)±0.15mm

シルクスクリーン:

白

はんだマスク:

緑

銅重量:

外層用 1オンス (1.4 ミル)

表面仕上げ:

電気のないニッケル電気のないパラジウムと浸水金 (ENEPIG)

最小注文数量:

1個

価格:

USD9.99-99.99

パッケージの詳細:

真空バッグ+カートン

受渡し時間:

8-9営業日

支払条件:

T/T

供給の能力:

1か月あたり5000pcs

ハイライト

Rogers TC600 PCB board

Double-sided ENEPIG PCB

0.8mm Rogers PCB

製品説明

Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

PCB Specification

Parameter	Details
Base Material	Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement)
Layer Count	Double sided (2-layer rigid PCB)
Board Dimensions	112mm x 60mm (1 piece)±0.15mm
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.3mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils total: 18μm base copper + 17μm plating per layer)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: Green; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer (Top)	18μm base copper + 17μm plating (finished: 1oz / 35μm total)	35 μm (1oz)
Dielectric Layer	Rogers TC600	0.762 mm (30 mils)
Copper Layer (Bottom)	18μm base copper + 17μm plating (finished: 1oz / 35μm total)	35 μm (1oz)

Material Overview: Rogers TC600 Laminates

Key Material Features

Specification	Value
Material Type	PTFE + thermally conductive ceramic fillers + woven glass reinforcement
Dielectric Constant (Dk)	6.15 at 1.8 MHz and 10 GHz / 23°C
Dissipation Factor (tanδ)	0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C
Thermal Conductivity	1.1 W/mK
Temperature Coefficient of Dielectric Constant (TCDk)	-75 ppm/°C (range: -40°C to 140°C)
Coefficient of Thermal Expansion (CTE)	X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C
Moisture Absorption	0.03%

Core Benefits

Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.

Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling--extending component lifespan.

Low Signal Loss: Ultra-low dielectric loss (0.0017-0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.

Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).

Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.

Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.

Typical Applications

This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:

Power Amplifiers, Filters, and Couplers
Microwave Combiner and Power Divider Boards (Avionics Applications)
Small Footprint Antennas
Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
GPS & Hand-held RFID Reader Antennas

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