|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This double-layer rigid PCB uses Rogers RO4003C Low Profile (LoPro) substrate and ENEPIG surface finish. With 1 oz (1.4 mils) outer copper cladding, 0.5mm finished thickness, and 20 μm via plating, it delivers stable electrical performance, superior signal integrity, and high-precision manufacturing. Its advanced low-loss properties make it ideal for high-frequency digital applications, cellular base station components, satellite LNBs, and RFID tags.
PCB Details
| Specifications | Details |
| Base material | Rogers RO4003C Low Profile |
| Layer count | Double-Layer |
| Board dimensions | 104.3mm x 78.65mm per unit |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | No blind vias |
| Finished board thickness | 0.5mm |
| Finished Cu weight | 1 oz (1.4 mils) on outer layers |
| Via plating thickness | 20 μm |
| Surface finish | ENEPIG |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Quality control | 100% electrical testing is performed prior to shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| Rogers RO4003C LoPro Substrate | 16.7mil (0.424mm) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB fabrication strictly complies with the Gerber RS-274-X format, which is the industry-recognized standard protocol for transmitting PCB manufacturing data.
Quality Standard
This PCB strictly adheres to the IPC-Class-2 standard, a globally recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard defines rigorous specifications for PCB quality, electrical performance, and operational reliability, making it well-suited for the majority of commercial and industrial applications that demand consistent operational stability and moderate dependability.
Availability
This PCB is offered for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to fulfill the requirements of both small-batch and large-volume orders.
Introduction to RO4003C Low Profile Base Material
Rogers RO4003C LoPro laminates utilize proprietary Rogers technology, which allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss, improving insertion loss and signal integrity while preserving all favorable characteristics of the standard RO4003C laminate system. As hydrocarbon ceramic laminates, RO4003C LoPro is designed to deliver superior high-frequency performance and cost-efficient circuit fabrication. It is a low-loss material compatible with standard epoxy/glass (FR-4) manufacturing processes and eliminates the necessity for specialized via preparation (e.g., sodium etch), thereby lowering manufacturing costs.
Key Features of RO4003C Low Profile
| Key Features | Specifications |
| Dielectric Constant (Dk) | 3.38±0.05 at 10 GHz/23°C |
| Dissipation Factor | 0.0027 at 10 GHz/23°C |
| Decomposition Temperature (Td) | > 425°C |
| Glass Transition Temperature (Tg) | > 280°C (TMA) |
| Thermal Conductivity | 0.64 W/mK |
| Z-axis Coefficient of Thermal Expansion (CTE) | 46 ppm/°C |
| Copper-Matched CTE (-55 to 288°C) | X-axis: 11 ppm/°C; Y-axis: 14 ppm/°C |
| Process Compatibility | Compatible with lead-free processes |
Core Benefits
-Lower insertion loss supports the design of higher operating frequency systems (exceeding 40 GHz)
-Reduced passive intermodulation (PIM) performance, making it ideal for base station antennas
-Improved thermal performance due to reduced conductor loss
-Enables multilayer PCB fabrication
-Offers exceptional design flexibility to meet diverse application requirements
-Compatible with high-temperature processing procedures
-Complies with relevant environmental regulations and requirements
-Exhibits resistance to Conductive Anodic Filament (CAF) formation
Typical Applications
-Digital applications: servers, routers, and high-speed backplanes
-Cellular base station antennas and power amplifiers
-Low Noise Blocks (LNBs) for direct broadcast satellites
-Radio Frequency Identification (RFID) Tags
Conclusion
This double-layer PCB represents a pinnacle of engineering precision, combining Rogers' proprietary RO4003C LoPro material science with rigorous manufacturing standards to deliver unmatched performance in mission-critical communication and signal processing applications.
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This double-layer rigid PCB uses Rogers RO4003C Low Profile (LoPro) substrate and ENEPIG surface finish. With 1 oz (1.4 mils) outer copper cladding, 0.5mm finished thickness, and 20 μm via plating, it delivers stable electrical performance, superior signal integrity, and high-precision manufacturing. Its advanced low-loss properties make it ideal for high-frequency digital applications, cellular base station components, satellite LNBs, and RFID tags.
PCB Details
| Specifications | Details |
| Base material | Rogers RO4003C Low Profile |
| Layer count | Double-Layer |
| Board dimensions | 104.3mm x 78.65mm per unit |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | No blind vias |
| Finished board thickness | 0.5mm |
| Finished Cu weight | 1 oz (1.4 mils) on outer layers |
| Via plating thickness | 20 μm |
| Surface finish | ENEPIG |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Quality control | 100% electrical testing is performed prior to shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| Rogers RO4003C LoPro Substrate | 16.7mil (0.424mm) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB fabrication strictly complies with the Gerber RS-274-X format, which is the industry-recognized standard protocol for transmitting PCB manufacturing data.
Quality Standard
This PCB strictly adheres to the IPC-Class-2 standard, a globally recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard defines rigorous specifications for PCB quality, electrical performance, and operational reliability, making it well-suited for the majority of commercial and industrial applications that demand consistent operational stability and moderate dependability.
Availability
This PCB is offered for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to fulfill the requirements of both small-batch and large-volume orders.
Introduction to RO4003C Low Profile Base Material
Rogers RO4003C LoPro laminates utilize proprietary Rogers technology, which allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss, improving insertion loss and signal integrity while preserving all favorable characteristics of the standard RO4003C laminate system. As hydrocarbon ceramic laminates, RO4003C LoPro is designed to deliver superior high-frequency performance and cost-efficient circuit fabrication. It is a low-loss material compatible with standard epoxy/glass (FR-4) manufacturing processes and eliminates the necessity for specialized via preparation (e.g., sodium etch), thereby lowering manufacturing costs.
Key Features of RO4003C Low Profile
| Key Features | Specifications |
| Dielectric Constant (Dk) | 3.38±0.05 at 10 GHz/23°C |
| Dissipation Factor | 0.0027 at 10 GHz/23°C |
| Decomposition Temperature (Td) | > 425°C |
| Glass Transition Temperature (Tg) | > 280°C (TMA) |
| Thermal Conductivity | 0.64 W/mK |
| Z-axis Coefficient of Thermal Expansion (CTE) | 46 ppm/°C |
| Copper-Matched CTE (-55 to 288°C) | X-axis: 11 ppm/°C; Y-axis: 14 ppm/°C |
| Process Compatibility | Compatible with lead-free processes |
Core Benefits
-Lower insertion loss supports the design of higher operating frequency systems (exceeding 40 GHz)
-Reduced passive intermodulation (PIM) performance, making it ideal for base station antennas
-Improved thermal performance due to reduced conductor loss
-Enables multilayer PCB fabrication
-Offers exceptional design flexibility to meet diverse application requirements
-Compatible with high-temperature processing procedures
-Complies with relevant environmental regulations and requirements
-Exhibits resistance to Conductive Anodic Filament (CAF) formation
Typical Applications
-Digital applications: servers, routers, and high-speed backplanes
-Cellular base station antennas and power amplifiers
-Low Noise Blocks (LNBs) for direct broadcast satellites
-Radio Frequency Identification (RFID) Tags
Conclusion
This double-layer PCB represents a pinnacle of engineering precision, combining Rogers' proprietary RO4003C LoPro material science with rigorous manufacturing standards to deliver unmatched performance in mission-critical communication and signal processing applications.
