|
| MOQ: | 1pcs |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空バッグ+カートン |
| 配達期間: | 8-9営業日 |
| 決済方法: | T/T |
| 供給能力: | 1か月あたり5000pcs |
This 2-layer rigid PCB serves high-frequency microwave applications, utilizing Rogers RT/duroid 6002—a premium ceramic-filled PTFE material—to achieve outstanding signal integrity and environmental resilience.Key construction specifications are as follows:
1. PCB Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 6002 (ceramic-filled PTFE microwave laminate) |
| Layer Count | 2 layers |
| Board Dimensions | 68mm x 52mm per piece (1PCS), no dimensional tolerance specified |
| Minimum Trace/Space | 5 mils (trace) / 5 mils (space) |
| Minimum Hole Size | 0.25mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Finished Board Thickness | 0.37mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers (Copper_layer_1 & Copper_layer_2) |
| Surface Finish | Immersion Silver (ensures excellent solderability and high-frequency signal performance) |
| Silkscreen | No silkscreen on top or bottom layers |
| Solder Mask | No solder mask on top or bottom layers (optimized for microwave signal transmission) |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
2. PCB Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Substrate Layer | Rogers RT/duroid 6002 | 0.254mm (10mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
3. Quality & Global Compliance
This PCB adheres to industry standards for compatibility, quality, and worldwide accessibility—ideal for large-scale or cross-regional projects:
Artwork Format: Gerber RS-274-X (universal industry standard, compatible with global fabrication facilities)
Quality Standard: IPC-Class-2 compliant (meets commercial/industrial reliability requirements for microwave systems)
Availability: Globally accessible, supporting timely production across regions.
4. Rogers RT/duroid 6002 Material Introduction
Rogers RT/duroid 6002 is a high-performance microwave laminate tailored for complex high-frequency structures. As a ceramic-filled PTFE material, it combines two key advantages: low dielectric constant (for stable signal propagation) and ultra-low loss (for preserving signal strength at microwave frequencies). It also delivers excellent mechanical and electrical properties, making it reliable for multi-layer board constructions—even in demanding environments like aerospace or radar systems. Unlike some microwave materials, it balances performance with manufacturability, supporting standard PCB processing workflows.
5. RT/duroid 6002 Key Features
The material’s features are engineered to meet the strict demands of microwave applications, ensuring consistent performance across operating conditions:
| Feature | Specification |
| Dielectric Constant (Dk) | 2.94 ± 0.04 |
| Thermal Coefficient of Dk | 12 ppm/°C |
| Dissipation Factor | 0.0012 at 10GHz |
| Decomposition Temperature (Td) | 500°C (TGA) |
| Thermal Conductivity | 0.6 W/m/k |
| Z-axis Coefficient of Thermal Expansion (CTE) | 24 ppm/°C |
| Moisture Absorption | 0.02% |
6. Material Benefits
The use of RT/duroid 6002 translates to tangible advantages for the PCB, making it ideal for high-frequency critical applications:
Ultra-Low Signal Loss: Dissipation factor of 0.0012 at 10GHz ensures excellent high-frequency performance, preserving signal integrity in microwave systems.
Temperature Stability: In-plane CTE matched to copper + low thermal coefficient of Dk (12 ppm/°C) ensures consistent performance in temperature-sensitive environments (e.g., airborne radar, outdoor antennas).
Dimensional Reliability: Tight thickness control and excellent dimensional stability reduce manufacturing variability, improving production yields for high-precision microwave circuits.
Space-Grade Suitability: Low out-gassing makes it ideal for space applications (e.g., satellite GPS antennas) where outgassed materials could interfere with system performance.
Multi-Layer Compatibility: Excellent mechanical/electrical properties enable reliable use in multi-layer constructions, supporting scalable designs for complex microwave systems.
7. Typical Applications
Leveraging its high-frequency performance and environmental resilience, this PCB is well-suited for the following applications:
Radar Systems: Ground-based and airborne radar (requires low loss and temperature stability)
Antennas: Phased array antennas, Global Positioning System (GPS) antennas (needs stable Dk for signal accuracy)
Aerospace & Aviation: Commercial airline collision avoidance systems (demands reliability in harsh environments)
High-Speed Connectivity: Power backplanes, beam forming networks (requires low signal loss for high-data-rate transmission)
|
|
| MOQ: | 1pcs |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空バッグ+カートン |
| 配達期間: | 8-9営業日 |
| 決済方法: | T/T |
| 供給能力: | 1か月あたり5000pcs |
This 2-layer rigid PCB serves high-frequency microwave applications, utilizing Rogers RT/duroid 6002—a premium ceramic-filled PTFE material—to achieve outstanding signal integrity and environmental resilience.Key construction specifications are as follows:
1. PCB Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 6002 (ceramic-filled PTFE microwave laminate) |
| Layer Count | 2 layers |
| Board Dimensions | 68mm x 52mm per piece (1PCS), no dimensional tolerance specified |
| Minimum Trace/Space | 5 mils (trace) / 5 mils (space) |
| Minimum Hole Size | 0.25mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Finished Board Thickness | 0.37mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers (Copper_layer_1 & Copper_layer_2) |
| Surface Finish | Immersion Silver (ensures excellent solderability and high-frequency signal performance) |
| Silkscreen | No silkscreen on top or bottom layers |
| Solder Mask | No solder mask on top or bottom layers (optimized for microwave signal transmission) |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
2. PCB Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Substrate Layer | Rogers RT/duroid 6002 | 0.254mm (10mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
3. Quality & Global Compliance
This PCB adheres to industry standards for compatibility, quality, and worldwide accessibility—ideal for large-scale or cross-regional projects:
Artwork Format: Gerber RS-274-X (universal industry standard, compatible with global fabrication facilities)
Quality Standard: IPC-Class-2 compliant (meets commercial/industrial reliability requirements for microwave systems)
Availability: Globally accessible, supporting timely production across regions.
4. Rogers RT/duroid 6002 Material Introduction
Rogers RT/duroid 6002 is a high-performance microwave laminate tailored for complex high-frequency structures. As a ceramic-filled PTFE material, it combines two key advantages: low dielectric constant (for stable signal propagation) and ultra-low loss (for preserving signal strength at microwave frequencies). It also delivers excellent mechanical and electrical properties, making it reliable for multi-layer board constructions—even in demanding environments like aerospace or radar systems. Unlike some microwave materials, it balances performance with manufacturability, supporting standard PCB processing workflows.
5. RT/duroid 6002 Key Features
The material’s features are engineered to meet the strict demands of microwave applications, ensuring consistent performance across operating conditions:
| Feature | Specification |
| Dielectric Constant (Dk) | 2.94 ± 0.04 |
| Thermal Coefficient of Dk | 12 ppm/°C |
| Dissipation Factor | 0.0012 at 10GHz |
| Decomposition Temperature (Td) | 500°C (TGA) |
| Thermal Conductivity | 0.6 W/m/k |
| Z-axis Coefficient of Thermal Expansion (CTE) | 24 ppm/°C |
| Moisture Absorption | 0.02% |
6. Material Benefits
The use of RT/duroid 6002 translates to tangible advantages for the PCB, making it ideal for high-frequency critical applications:
Ultra-Low Signal Loss: Dissipation factor of 0.0012 at 10GHz ensures excellent high-frequency performance, preserving signal integrity in microwave systems.
Temperature Stability: In-plane CTE matched to copper + low thermal coefficient of Dk (12 ppm/°C) ensures consistent performance in temperature-sensitive environments (e.g., airborne radar, outdoor antennas).
Dimensional Reliability: Tight thickness control and excellent dimensional stability reduce manufacturing variability, improving production yields for high-precision microwave circuits.
Space-Grade Suitability: Low out-gassing makes it ideal for space applications (e.g., satellite GPS antennas) where outgassed materials could interfere with system performance.
Multi-Layer Compatibility: Excellent mechanical/electrical properties enable reliable use in multi-layer constructions, supporting scalable designs for complex microwave systems.
7. Typical Applications
Leveraging its high-frequency performance and environmental resilience, this PCB is well-suited for the following applications:
Radar Systems: Ground-based and airborne radar (requires low loss and temperature stability)
Antennas: Phased array antennas, Global Positioning System (GPS) antennas (needs stable Dk for signal accuracy)
Aerospace & Aviation: Commercial airline collision avoidance systems (demands reliability in harsh environments)
High-Speed Connectivity: Power backplanes, beam forming networks (requires low signal loss for high-data-rate transmission)
