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商品の詳細:
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| 基本材料: | ロジャース RO3210 | レイヤーカウント: | 2層 |
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| PCBの厚さ: | 0.6mm | PCBサイズ: | 54.5mm×50mm |
| 銅重量: | 1オンス（1.4ミルまたは35μmに相当） | 表面仕上げ: | 浸漬ゴールド |
| ハイライト: | Rogers RO3210 PCB board,0.6mm thick Rogers PCB,white silkscreen Rogers PCB |
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This PCB is a high-performance 2-layer rigid board crafted from Rogers RO3210 material, designed to meet strict electrical and mechanical standards. It is ideally suited for applications that demand low-loss, high-frequency performance, such as 5G communication infrastructure etc.
1. PCB Specifications
| Parameter | Value |
| Base Material | Rogers RO3210 (ceramic-filled, woven fiberglass-reinforced PTFE laminate) |
| Layer Count | 2-layer (rigid structure) |
| Board Dimensions | 54.5mm x 50mm per piece, with a tolerance of ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 8 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; all vias feature a plating thickness of 20 μm |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1oz (equivalent to 1.4 mils) for outer layers (Copper_layer_1 and Copper_layer_2) |
| Surface Finish | Immersion Gold (ensures excellent solderability and corrosion resistance) |
| Silkscreen | White silkscreen on the top layer; no silkscreen on the bottom layer |
| Solder Mask | Blue solder mask on the top layer; no solder mask on the bottom layer |
| Quality Assurance | 100% electrical testing conducted prior to shipment to ensure functional integrity |
2. PCB Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz finished copper weight) |
| Core Layer | Rogers RO3210 | 0.508mm (20mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm |
3. Artwork and Quality Standards
Artwork Format: Gerber RS-274-X (the industry-standard format for PCB manufacturing, ensuring compatibility with most fabrication equipment)
Quality Standard: Complies with IPC-Class-2 (meets high reliability requirements for commercial and industrial applications)
Availability: Globally available, supporting global project requirement.
4. Introduction to Rogers RO3210 Base Material
Rogers' RO3210 is a premium high-frequency circuit material engineered for demanding applications. It is a ceramic-filled laminate reinforced with woven fiberglass, combining two key advantages: the surface smoothness of non-woven PTFE laminates (enabling finer line etching) and the rigidity of woven-glass PTFE laminates (enhancing handling and durability). Critically, RO3210 can be fabricated into PCBs using standard PTFE circuit board processing techniques, simplifying manufacturing without compromising performance.
5. Key Features of RO3210 Material
| Property | Value | Significance |
| Dielectric Constant (Dk) | 10.2 ± 0.5 | Stable across frequency ranges, ideal for high-frequency signal integrity |
| Dissipation Factor | 0.0027 at 10GHz | Extremely low, minimizing signal loss in high-frequency applications |
| Coefficient of Thermal Expansion (CTE) | x-axis: 13 ppm/°Cy-axis: 13 ppm/°Cz-axis: 34 ppm/°C | Matched to copper, reduces thermal stress during assembly and operation |
| Decomposition Temperature (Td) | 500 °C (TGA) | Ensures stability at high temperatures during soldering and harsh operating conditions |
| Thermal Conductivity | 0.81 W/mK | Enables efficient heat dissipation, protecting components from overheating |
| Flammability | Complies with UL 94 V0 standard | High fire resistance, enhancing safety in various environments |
6. Benefits of RO3210 Material (and the PCB)
The use of RO3210 translates to multiple advantages for the PCB, making it suitable for high-performance applications:
Woven Glass Reinforcement: Improves rigidity, making the PCB easier to handle during manufacturing, assembly, and installation.
Uniform Electrical and Mechanical Performance: Ensures consistency across the board, making it ideal for complex multi-layer high-frequency structures.
Low In-Plane Expansion Coefficient (Matched to Copper):
Suitable for hybrid designs with epoxy multi-layer boards (enabling integration into larger systems).
Supports reliable surface-mounted assemblies (reducing the risk of solder joint failure due to thermal mismatch).
Excellent Dimensional Stability: Minimizes warpage or distortion during manufacturing and operation, leading to high production yields and long-term reliability.
Surface Smoothness: Allows for finer line etching tolerances (supporting the PCB’s 5/8 mils trace/space requirement) and precise component placement.
7. Typical Applications
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
コンタクトパーソン: Ms. Ivy Deng
電話番号: 86-755-27374946
ファックス: 86-755-27374848
Japanese
