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2-Layer Rogers RT duroid 6010.2LM PCB 75mil Thick

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2-Layer Rogers RT duroid 6010.2LM PCB 75mil Thick

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

起源の場所

ブランド名

Bicheng

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース RT/デュロイド 6010.2LM

レイヤーカウント:

PCBの厚さ:

2.0mm

プリント基板のサイズ:

45.4mm×31.8mm(1本)±0.15mm

シルクスクリーン:

はんだマスク:

1オンス (1.4ミル/35μm)

表面仕上げ:

浸漬シルバー

ハイライト:

Rogers RT duroid 6010.2LM PCB

2-layer Rogers PCB board

75mil thick Rogers PCB

製品説明

2-Layer Rogers RT duroid 6010.2LM PCB 75mil Thick

This high-reliability 2-layer PCB is built with Rogers RT/duroid 6010.2LM--a premium ceramic-PTFE composite optimized for electronic and microwave circuits requiring high dielectric constant (Dk) and minimal loss. Engineered to enable compact design while ensuring consistent performance, it meets IPC-Class-2 quality standards and is ideal for X-band and below applications where space efficiency and signal integrity are critical.

PCB Specification

Parameter	Details
Base Material	Rogers RT/duroid 6010.2LM (ceramic-PTFE composite core)
Layer Count	2-Layer rigid PCB
Board Dimensions	45.4mm x 31.8mm (1 piece)±0.15mm
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.3mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	2.0mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver (enhances conductivity, ensures reliable soldering)
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Rogers RT/duroid 6010.2LM	1.905 mm (75 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Rogers RT/duroid 6010.2LM

Rogers RT/duroid 6010.2LM is a specialized ceramic-PTFE composite laminate designed for high-frequency circuits that demand both high dielectric constant and low loss. Its formulation enables significant circuit size reduction (critical for space-constrained systems) while maintaining tight control over Dk and thickness--ensuring repeatable performance across production runs. The material also features exceptional thermal and mechanical stability, including low Z-axis expansion, making it compatible with reliable plated through-hole designs (even for multi-layer scaling).

Key Material Features

Specification	Value
Material Type	Ceramic-PTFE composite
Dielectric Constant (Dk)	10.2 ± 0.25 at 10 GHz
Dissipation Factor (tanδ)	0.0023 at 10 GHz
Decomposition Temperature (Td, TGA)	500 °C
Moisture Absorption	0.01%
Coefficient of Thermal Expansion (CTE)	X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C
Thermal Conductivity	0.86 W/mK
Flammability Rating	UL 94 V-0

Core Benefits

Enables Compact Circuit Design: With a high Dk of 10.2, the material significantly reduces PCB footprint--ideal for space-constrained microwave and electronic systems.
Optimized for Low-Frequency Signal Integrity: Ultra-low dissipation factor (0.0023) ensures minimal signal attenuation, making it perfect for applications operating at X-band and below.
Reliable Multi-Layer Compatibility: Low Z-axis CTE (47 ppm/°C) prevents thermal stress on plated through-holes, ensuring long-term reliability even when scaling to multi-layer designs.
Moisture-Immune Performance: Near-zero moisture absorption (0.01%) eliminates moisture-related signal loss or degradation, even in harsh or humid environments.
Consistent Production Quality: Tight control over Dk (±0.25) and thickness guarantees uniform performance across every PCB, reducing production variability and improving end-system reliability.

Typical Applications

This PCB is engineered for high-performance, space-efficient systems, including:

Patch Antennas
Satellite Communications Systems
Power Amplifiers
Aircraft Collision Avoidance Systems
Ground Radar Warning Systems

タグ:

製品

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

詳細情報

製品説明

詳細情報

起源の場所

中国

ブランド名

Bicheng

証明

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース RT/デュロイド 6010.2LM

レイヤーカウント:

2層

PCBの厚さ:

2.0mm

プリント基板のサイズ:

45.4mm×31.8mm(1本)±0.15mm

シルクスクリーン:

白

はんだマスク:

いいえ

銅重量:

1オンス (1.4ミル/35μm)

表面仕上げ:

浸漬シルバー

最小注文数量:

1個

価格:

USD9.99-99.99

パッケージの詳細:

真空バッグ+カートン

受渡し時間:

8-9営業日

支払条件:

T/T

供給の能力:

1か月あたり5000pcs

ハイライト

Rogers RT duroid 6010.2LM PCB

2-layer Rogers PCB board

75mil thick Rogers PCB

製品説明

2-Layer Rogers RT duroid 6010.2LM PCB 75mil Thick

PCB Specification

Parameter	Details
Base Material	Rogers RT/duroid 6010.2LM (ceramic-PTFE composite core)
Layer Count	2-Layer rigid PCB
Board Dimensions	45.4mm x 31.8mm (1 piece)±0.15mm
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.3mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	2.0mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver (enhances conductivity, ensures reliable soldering)
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Rogers RT/duroid 6010.2LM	1.905 mm (75 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Rogers RT/duroid 6010.2LM

Key Material Features

Specification	Value
Material Type	Ceramic-PTFE composite
Dielectric Constant (Dk)	10.2 ± 0.25 at 10 GHz
Dissipation Factor (tanδ)	0.0023 at 10 GHz
Decomposition Temperature (Td, TGA)	500 °C
Moisture Absorption	0.01%
Coefficient of Thermal Expansion (CTE)	X-axis: 24 ppm/°C; Y-axis: 24 ppm/°C; Z-axis: 47 ppm/°C
Thermal Conductivity	0.86 W/mK
Flammability Rating	UL 94 V-0

Core Benefits

Enables Compact Circuit Design: With a high Dk of 10.2, the material significantly reduces PCB footprint--ideal for space-constrained microwave and electronic systems.
Optimized for Low-Frequency Signal Integrity: Ultra-low dissipation factor (0.0023) ensures minimal signal attenuation, making it perfect for applications operating at X-band and below.
Reliable Multi-Layer Compatibility: Low Z-axis CTE (47 ppm/°C) prevents thermal stress on plated through-holes, ensuring long-term reliability even when scaling to multi-layer designs.
Moisture-Immune Performance: Near-zero moisture absorption (0.01%) eliminates moisture-related signal loss or degradation, even in harsh or humid environments.
Consistent Production Quality: Tight control over Dk (±0.25) and thickness guarantees uniform performance across every PCB, reducing production variability and improving end-system reliability.

Typical Applications

This PCB is engineered for high-performance, space-efficient systems, including:

Patch Antennas
Satellite Communications Systems
Power Amplifiers
Aircraft Collision Avoidance Systems
Ground Radar Warning Systems

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