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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • 名前

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

MOQ: 1個
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 1か月あたり5000pcs
詳細 情報
製品説明
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-332.V1.0
基本材料:
Rogers RO4003C ロープロファイル (LoPro)
レイヤーカウント:
2層
PCBの厚さ:
0.65mm
プリント基板のサイズ:
1個あたり64mm x 68.4mm (1PCS)
シルクスクリーン:
白
はんだマスク:
緑
銅重量:
外層用 1オンス (1.4 ミル)
表面仕上げ:
銀下地メッキ＋金メッキ
ハイライト:

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

製品説明
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
タグ: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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製品
商品の詳細
製品

RF PCB板

ロジャースPCB板

PTFE PCB板

高いTg PCB

多層PCB

Taconic PCB

HDI PCB板

高速PCB

インピーダンスはPCBを制御した

適用範囲が広いPCB板

fr4 PCB板

PCBのステンシル

金属の中心PCB
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • 名前
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
MOQ: 1個
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 1か月あたり5000pcs
詳細情報
製品説明
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-332.V1.0
基本材料:
Rogers RO4003C ロープロファイル (LoPro)
レイヤーカウント:
2層
PCBの厚さ:
0.65mm
プリント基板のサイズ:
1個あたり64mm x 68.4mm (1PCS)
シルクスクリーン:
白
はんだマスク:
緑
銅重量:
外層用 1オンス (1.4 ミル)
表面仕上げ:
銀下地メッキ＋金メッキ
最小注文数量:
1個
価格:
USD9.99-99.99
パッケージの詳細:
真空バッグ+カートン
受渡し時間:
8-9営業日
支払条件:
T/T
供給の能力:
1か月あたり5000pcs
ハイライト

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

製品説明
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
タグ: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan、Fuyong、Baoan、シンセン、広東省、中国518103
電話: 86-755-27374946
地図 |  プライバシーポリシー | 中国 良い 品質 RF PCB板 提供者 著作権 2020-2025 Bicheng Electronics Technology Co., Ltd すべて 権利は保護されています.