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Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

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Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

起源の場所

ブランド名

Bicheng

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース RO3203

レイヤーカウント:

PCBの厚さ:

0.35mm

プリント基板のサイズ:

1個あたり74.57mm x 23.28mm (1PCS)、

シルクスクリーン:

はんだマスク:

外層用 1オンス (1.4 ミル)

表面仕上げ:

ENEPIG

ハイライト:

Rogers RO3203 double-layer PCB

10mil ENEPIG finish PCB

Rogers PCB with ENEPIG coating

製品説明

Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

This 2-layer rigid PCB is tailored for high-frequency applications (exceeding 40 GHz), leveraging Rogers RO3203—a ceramic-filled, woven fiberglass-reinforced laminate—to deliver exceptional signal integrity, mechanical stability, and cost-effectiveness.

PCB Specification

Parameter	Details
Base Material	Rogers RO3203 (ceramic-filled, woven fiberglass-reinforced PTFE composite)
Layer Count	2-Layer (rigid structure)
Board Dimensions	74.57mm x 23.28mm per piece (1PCS)
Minimum Trace/Space	4 mils (trace) / 7 mils (space)
Minimum Hole Size	0.2mm
Vias	No blind vias; via plating thickness = 20 μm
Finished Board Thickness	0.35mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	ENEPIG
Silkscreen	White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer, no solder mask on bottom layer
Quality Assurance	100% electrical testing conducted prior to shipment

PCB Stack-up Configuration

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO3203	0.254mm (10mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO3203 Material Introduction

Rogers RO3203 is a premium high-frequency circuit material designed as an extension of the RO3000 Series, with a key focus on improved mechanical stability without compromising electrical performance. As a ceramic-filled laminate reinforced with woven fiberglass, it balances three critical attributes: exceptional electrical performance (suitable for frequencies beyond 40 GHz), robust mechanical stability, and competitive pricing—making it ideal for volume manufacturing of high-frequency devices.

Its core electrical properties—dielectric constant (Dk) of 3.02 and dissipation factor (DF) of 0.0016—enable reliable signal propagation at ultra-high frequencies, while its woven glass reinforcement ensures durability during handling and assembly. Unlike some high-frequency materials, RO3203 is also lead-free process compatible, aligning with global environmental standards.

RO3203 Key Features

Feature	Specification
Material Composition	Ceramic-filled PTFE composite (woven fiberglass-reinforced)
Dielectric Constant (Dk)	3.02 ± 0.04 at 10GHz/23°C
Dissipation Factor (DF)	0.0016 at 10GHz/23°C
Decomposition Temperature (Td)	>500°C
Thermal Conductivity	0.87 W/mK
Coefficient of Thermal Expansion (CTE)	X-axis: 13 ppm/°C; Y-axis: 13 ppm/°C; Z-axis: 58 ppm/°C (-55 to 288°C)
Process Compatibility	Lead-free process compatible
Flammability Rating	UL 94 V-0

Benefits

RO3203's properties translate to tangible advantages for the PCB, addressing key challenges in ultra-high-frequency design and volume manufacturing:

Ultra-High-Frequency Performance: Low DF (0.0016) and stable Dk (3.02 ± 0.04) enable reliable operation beyond 40 GHz.
Mechanical Stability: Woven glass reinforcement improves rigidity, making the PCB easier to handle during assembly and resistant to warpage.
Thermal Compatibility: Low in-plane CTE (13 ppm/°C for X/Y axes) matched to copper prevents solder joint failure during thermal cycling, supporting reliable surface-mounted assemblies.
Cost-Effectiveness: Economically priced for volume manufacturing, reducing total production costs without sacrificing high-frequency performance.
Surface Smoothness: Enables finer line etching tolerances for precise high-frequency circuit routing.
Safety & Compliance: UL 94 V-0 flammability rating and lead-free compatibility meet global safety and environmental standards.

Typical Applications

This PCB is designed for use in critical electronic systems, including:

Automotive: Collision avoidance systems, GPS antennas
Wireless Communications: Base station infrastructure, LMDS (Local Multipoint Distribution Service), wireless broadband, microstrip patch antennas
Satellite & Telecom: Direct broadcast satellites (DBS), wireless telecommunications systems, datalink on cable systems
Industrial & Consumer: Remote meter readers, power backplanes

Availability: Worldwide

This PCB is globally accessible for production and delivery, addressing the logistical needs of multi-region high-frequency projects.

タグ:

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金属の中心PCB

Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

詳細情報

製品説明

詳細情報

起源の場所

中国

ブランド名

Bicheng

証明

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース RO3203

レイヤーカウント:

2層

PCBの厚さ:

0.35mm

プリント基板のサイズ:

1個あたり74.57mm x 23.28mm (1PCS)、

シルクスクリーン:

白

はんだマスク:

緑

銅重量:

外層用 1オンス (1.4 ミル)

表面仕上げ:

ENEPIG

最小注文数量:

1個

価格:

USD9.99-99.99

パッケージの詳細:

真空バッグ+カートン

受渡し時間:

8-9営業日

支払条件:

T/T

供給の能力:

1か月あたり5000pcs

ハイライト

Rogers RO3203 double-layer PCB

10mil ENEPIG finish PCB

Rogers PCB with ENEPIG coating

製品説明

Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

PCB Specification

Parameter	Details
Base Material	Rogers RO3203 (ceramic-filled, woven fiberglass-reinforced PTFE composite)
Layer Count	2-Layer (rigid structure)
Board Dimensions	74.57mm x 23.28mm per piece (1PCS)
Minimum Trace/Space	4 mils (trace) / 7 mils (space)
Minimum Hole Size	0.2mm
Vias	No blind vias; via plating thickness = 20 μm
Finished Board Thickness	0.35mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	ENEPIG
Silkscreen	White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer, no solder mask on bottom layer
Quality Assurance	100% electrical testing conducted prior to shipment

PCB Stack-up Configuration

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO3203	0.254mm (10mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO3203 Material Introduction

RO3203 Key Features

Feature	Specification
Material Composition	Ceramic-filled PTFE composite (woven fiberglass-reinforced)
Dielectric Constant (Dk)	3.02 ± 0.04 at 10GHz/23°C
Dissipation Factor (DF)	0.0016 at 10GHz/23°C
Decomposition Temperature (Td)	>500°C
Thermal Conductivity	0.87 W/mK
Coefficient of Thermal Expansion (CTE)	X-axis: 13 ppm/°C; Y-axis: 13 ppm/°C; Z-axis: 58 ppm/°C (-55 to 288°C)
Process Compatibility	Lead-free process compatible
Flammability Rating	UL 94 V-0

Benefits

RO3203's properties translate to tangible advantages for the PCB, addressing key challenges in ultra-high-frequency design and volume manufacturing:

Ultra-High-Frequency Performance: Low DF (0.0016) and stable Dk (3.02 ± 0.04) enable reliable operation beyond 40 GHz.
Mechanical Stability: Woven glass reinforcement improves rigidity, making the PCB easier to handle during assembly and resistant to warpage.
Thermal Compatibility: Low in-plane CTE (13 ppm/°C for X/Y axes) matched to copper prevents solder joint failure during thermal cycling, supporting reliable surface-mounted assemblies.
Cost-Effectiveness: Economically priced for volume manufacturing, reducing total production costs without sacrificing high-frequency performance.
Surface Smoothness: Enables finer line etching tolerances for precise high-frequency circuit routing.
Safety & Compliance: UL 94 V-0 flammability rating and lead-free compatibility meet global safety and environmental standards.

Typical Applications

This PCB is designed for use in critical electronic systems, including:

Automotive: Collision avoidance systems, GPS antennas
Wireless Communications: Base station infrastructure, LMDS (Local Multipoint Distribution Service), wireless broadband, microstrip patch antennas
Satellite & Telecom: Direct broadcast satellites (DBS), wireless telecommunications systems, datalink on cable systems
Industrial & Consumer: Remote meter readers, power backplanes

Availability: Worldwide

This PCB is globally accessible for production and delivery, addressing the logistical needs of multi-region high-frequency projects.

タグ: