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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

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金属の中心PCB

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Ms. Ivy Deng

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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

起源の場所

ブランド名

Bicheng

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース RO4360G2

レイヤーカウント:

PCBの厚さ:

0.9mm

プリント基板のサイズ:

1個あたり73.12mm x 44.71mm (1PCS)、

シルクスクリーン:

はんだマスク:

外層用 1オンス (1.4 ミル)

表面仕上げ:

浸漬ゴールド

ハイライト:

RO4360G2 PCB 2 layer

Rogers PCB immersion gold finish

32mil substrate PCB board

製品説明

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.

PCB Specification

Parameter	Details
Base Material	Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count	2 layers (rigid structure)
Board Dimensions	73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space	5 mils (trace) / 6 mils (space)
Minimum Hole Size	0.30mm
Vias	No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness	0.9mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Immersion Gold
Silkscreen	White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing prior shipment

PCB Stack-up

The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO4360G2	0.813mm (32mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO4360G2 Material Introduction

Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.

Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts

Key Material Features

Feature	Specification
Dielectric Constant (Dk)	6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF)	0.0038 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >407°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.75 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 13 ppm/°C - Y-axis: 14 ppm/°C - Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating	UL 94 V-0
Process Compatibility	Lead-free process compatible; FR-4-like fabrication

Core Benefits

High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.

Some Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers

The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.

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金属の中心PCB

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

詳細情報

製品説明

詳細情報

起源の場所

中国

ブランド名

Bicheng

証明

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース RO4360G2

レイヤーカウント:

2層

PCBの厚さ:

0.9mm

プリント基板のサイズ:

1個あたり73.12mm x 44.71mm (1PCS)、

シルクスクリーン:

白

はんだマスク:

緑

銅重量:

外層用 1オンス (1.4 ミル)

表面仕上げ:

浸漬ゴールド

最小注文数量:

1個

価格:

USD9.99-99.99

パッケージの詳細:

真空バッグ+カートン

受渡し時間:

8-9営業日

支払条件:

T/T

供給の能力:

1か月あたり5000pcs

ハイライト

RO4360G2 PCB 2 layer

Rogers PCB immersion gold finish

32mil substrate PCB board

製品説明

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

PCB Specification

Parameter	Details
Base Material	Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count	2 layers (rigid structure)
Board Dimensions	73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space	5 mils (trace) / 6 mils (space)
Minimum Hole Size	0.30mm
Vias	No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness	0.9mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Immersion Gold
Silkscreen	White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing prior shipment

PCB Stack-up

The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO4360G2	0.813mm (32mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO4360G2 Material Introduction

Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts

Key Material Features

Feature	Specification
Dielectric Constant (Dk)	6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF)	0.0038 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >407°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.75 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 13 ppm/°C - Y-axis: 14 ppm/°C - Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating	UL 94 V-0
Process Compatibility	Lead-free process compatible; FR-4-like fabrication

Core Benefits

High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.

Some Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers

The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.

タグ: