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RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate

RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate

MOQ: 1個
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 5000個/月
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-332.V1.0
基材:
ロジャースRO3003
レイヤーカウント:
2層
PCBの厚さ:
0.3mm
プリント基板のサイズ:
254mm×142mm
シルクスクリーン:
いいえ
はんだマスク:
いいえ
銅重量:
外層用 1オンス (1.4 ミル)
表面仕上げ:
シルバープレート / ゴールドプレート
ハイライト:

Gold Plate RO3003 PCB

,

Silver Plate RO3003 PCB

,

Gold plate double layer circuit board

製品説明

Utilizing Rogers RO3003 high-frequency laminate as the base material, this PCB is tailored for commercial microwave and RF applications. RO3003 is a ceramic-filled PTFE composite that endows the PCB with excellent dielectric constant stability over a wide temperature and frequency range, as well as low dielectric loss. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including automotive radar, 5G mmWave infrastructure and advanced driver assistance systems (ADAS).

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO3003 (ceramic-filled PTFE composite high-frequency laminate)
Board Dimensions 254mm × 142mm, 50 pieces per set, tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 4 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; Total vias: 250; Via plating thickness: 20 μm
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver plate / Gold plate
Silkscreen No silkscreen on top layer; White silkscreen on bottom layer
Solder Mask No solder mask on top layer; Green solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO3003 Core 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO3003 Material Introduction

Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. RO3003 laminates offer excellent stability of dielectric constant (Dk) over various temperatures and frequencies. This stability also includes the elimination of the step change in Dk that typically occurs near room temperature with PTFE glass materials.

 

RO3003 is ideal for high-frequency applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS) and 5G wireless infrastructure (mmWave), providing reliable performance in demanding operating environments.

 

RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO3003 ceramic-filled PTFE composites
Dielectric Constant (Dk) 3 ± 0.04 at 10 GHz/23°C
Dissipation Factor 0.001 at 10 GHz/23°C
Decomposition Temperature (Td) > 500°C
Thermal Conductivity 0.5 W/mK
Moisture Absorption 0.04%
Coefficient of Thermal Expansion (CTE) X axis: 17 ppm/°C; Y axis: 16 ppm/°C; Z axis: 25 ppm/°C (-55°C to 288°C)
Surface Finish Advantage Silver plate/gold plate options ensure excellent solderability and corrosion resistance

 

Core Benefits

Low Dielectric Loss for High-Frequency Operation: Dissipation factor of 0.001 enables reliable use in applications up to 77 GHz.

 

Excellent Dk Stability: Superior dielectric constant stability over temperature and frequency, eliminating room-temperature Dk step change common in PTFE glass materials.

 

Reliable Mechanical Performance: Excellent mechanical properties versus temperature, suitable for reliable stripline and multi-layer board constructions.

 

Uniform Mechanical Properties: Consistent performance across a range of dielectric constants, ideal for multi-layer designs and epoxy glass hybrid constructions.

 

Low In-Plane Expansion: CTE matched to copper, enabling more reliable surface mounted assemblies and excellent dimensional stability for temperature-sensitive applications.

 

Cost-Effective Volume Production: Economical laminate pricing with mature volume manufacturing processes.

 

Low Environmental Sensitivity: Moisture absorption of 0.04% minimizes performance degradation in humid conditions.

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

 

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

 

Typical Applications

-Automotive radar applications

-Global positioning satellite antennas

-Cellular telecommunications systems - power amplifiers and antennas

-Patch antenna for wireless communications

-Direct broadcast satellites

-Datalink on cable systems

-Remote meter readers

-Power backplanes

 

RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate 1

製品
商品の詳細
RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate
MOQ: 1個
価格: USD9.99-99.99
標準パッケージ: 真空バッグ+カートン
配達期間: 8-9営業日
決済方法: T/T
供給能力: 5000個/月
詳細情報
起源の場所
中国
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
モデル番号
BIC-332.V1.0
基材:
ロジャースRO3003
レイヤーカウント:
2層
PCBの厚さ:
0.3mm
プリント基板のサイズ:
254mm×142mm
シルクスクリーン:
いいえ
はんだマスク:
いいえ
銅重量:
外層用 1オンス (1.4 ミル)
表面仕上げ:
シルバープレート / ゴールドプレート
最小注文数量:
1個
価格:
USD9.99-99.99
パッケージの詳細:
真空バッグ+カートン
受渡し時間:
8-9営業日
支払条件:
T/T
供給の能力:
5000個/月
ハイライト

Gold Plate RO3003 PCB

,

Silver Plate RO3003 PCB

,

Gold plate double layer circuit board

製品説明

Utilizing Rogers RO3003 high-frequency laminate as the base material, this PCB is tailored for commercial microwave and RF applications. RO3003 is a ceramic-filled PTFE composite that endows the PCB with excellent dielectric constant stability over a wide temperature and frequency range, as well as low dielectric loss. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including automotive radar, 5G mmWave infrastructure and advanced driver assistance systems (ADAS).

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO3003 (ceramic-filled PTFE composite high-frequency laminate)
Board Dimensions 254mm × 142mm, 50 pieces per set, tolerance ±0.15mm
Minimum Trace/Space 5 mils (trace) / 4 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; Total vias: 250; Via plating thickness: 20 μm
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver plate / Gold plate
Silkscreen No silkscreen on top layer; White silkscreen on bottom layer
Solder Mask No solder mask on top layer; Green solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO3003 Core 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO3003 Material Introduction

Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. RO3003 laminates offer excellent stability of dielectric constant (Dk) over various temperatures and frequencies. This stability also includes the elimination of the step change in Dk that typically occurs near room temperature with PTFE glass materials.

 

RO3003 is ideal for high-frequency applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS) and 5G wireless infrastructure (mmWave), providing reliable performance in demanding operating environments.

 

RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO3003 ceramic-filled PTFE composites
Dielectric Constant (Dk) 3 ± 0.04 at 10 GHz/23°C
Dissipation Factor 0.001 at 10 GHz/23°C
Decomposition Temperature (Td) > 500°C
Thermal Conductivity 0.5 W/mK
Moisture Absorption 0.04%
Coefficient of Thermal Expansion (CTE) X axis: 17 ppm/°C; Y axis: 16 ppm/°C; Z axis: 25 ppm/°C (-55°C to 288°C)
Surface Finish Advantage Silver plate/gold plate options ensure excellent solderability and corrosion resistance

 

Core Benefits

Low Dielectric Loss for High-Frequency Operation: Dissipation factor of 0.001 enables reliable use in applications up to 77 GHz.

 

Excellent Dk Stability: Superior dielectric constant stability over temperature and frequency, eliminating room-temperature Dk step change common in PTFE glass materials.

 

Reliable Mechanical Performance: Excellent mechanical properties versus temperature, suitable for reliable stripline and multi-layer board constructions.

 

Uniform Mechanical Properties: Consistent performance across a range of dielectric constants, ideal for multi-layer designs and epoxy glass hybrid constructions.

 

Low In-Plane Expansion: CTE matched to copper, enabling more reliable surface mounted assemblies and excellent dimensional stability for temperature-sensitive applications.

 

Cost-Effective Volume Production: Economical laminate pricing with mature volume manufacturing processes.

 

Low Environmental Sensitivity: Moisture absorption of 0.04% minimizes performance degradation in humid conditions.

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.

 

Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.

 

Typical Applications

-Automotive radar applications

-Global positioning satellite antennas

-Cellular telecommunications systems - power amplifiers and antennas

-Patch antenna for wireless communications

-Direct broadcast satellites

-Datalink on cable systems

-Remote meter readers

-Power backplanes

 

RO3003 PCB 2-layer 10mil Rogers Laminate Silver plate / Gold plate 1

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