|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This PCB is a high-frequency 2-layer rigid printed circuit board using Rogers RO4730G3, a premium antenna-grade laminate engineered for high-frequency applications. It leverages the material’s stable dielectric constant and low dissipation factor to ensure superior signal integrity, delivering low signal loss and consistent performance—critical for cellular base station antennas and reliable communication efficiency.
PCB Construction Details
| Item | Specifications |
| Base Material | Rogers RO4730G3 (Hydrocarbon/Ceramic/Woven Glass Composite) |
| Layer Count | 2 layers (no blind vias included) |
| Board Dimensions | 85.6mm x 103mm per unit, with a dimensional tolerance of +/- 0.15mm |
| Minimum Trace/Space | 4 mil trace width / 6 mil spacing |
| Minimum Hole Size | 0.3mm |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1 oz (equivalent to 1.4 mils) for outer copper layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Blue |
| Bottom Solder Mask | Not applied |
| Quality Control | 100% electrical testing performed before shipment |
PCB Stack-up
| Layer | Description | Thickness |
| 1 | Copper Layer 1 (Outer Top) | 35 μm |
| - | Rogers RO4730G3 Core (Dielectric Layer) | 0.508 mm (20 mil) |
| 2 | Copper Layer 2 (Outer Bottom) | 35 μm |
Artwork, Quality Standard and Availability
In terms of artwork, quality, and availability, the PCB is supplied with artwork in the Gerber RS-274-X format—an industry standard for PCB manufacturing that ensures compatibility with most mainstream production equipment. The PCB meets the IPC-Class-2 quality standard, a widely accepted benchmark that ensures consistent performance and manufacturing quality. Furthermore, this PCB is available for shipping worldwide, making it suitable for international projects.
Introduction to Rogers RO4730G3 Material
Rogers RO4730G3 is an antenna-grade laminate with a UL 94 V-0 flammability rating, composed of hydrocarbon, ceramic, and woven glass. It acts as a reliable, cost-efficient alternative to traditional PTFE-based laminates, with resin systems that provide the key properties needed for optimal antenna performance. Fully compatible with standard FR-4 processing and high-temperature lead-free soldering, RO4730G3 eliminates the need for special plated through-hole (PTH) preparation that is required for conventional PTFE materials. This makes it an economical choice for antenna applications, allowing designers to effectively balance performance and cost.
Key Features of Rogers RO4730G3 Material
| Key Features | Specifications |
| Dielectric Constant (Dk) | 3.0 +/- 0.05 at 10GHz |
| Dissipation Factor | 0.0028 at 10GHz |
| Thermal Coefficient of Dk (TCDk) | 34 ppm/°C |
| Coefficient of Thermal Expansion (CTE) | X-axis: 15.9 ppm/°C; Y-axis: 14.4 ppm/°C; Z-axis: 35.2 ppm/°C (matched to copper) |
| Glass Transition Temperature (Tg) | Greater than 280 °C |
| Decomposition Temperature (Td) | 411 °C (measured via TGA) |
| Thermal Conductivity | 0.45 W/mk |
Benefits of Rogers RO4730G3 Material
-Low-loss dielectric paired with low-profile foil, which reduces Passive Intermodulation (PIM) and minimizes insertion loss.
-Unique filler and closed microsphere structure, offering low density and a 30% weight reduction compared to PTFE/Glass alternatives.
-Low Z-axis CTE (<30 ppm/°C) and high Tg (>280°C), providing greater design flexibility and compatibility with automated assembly processes.
-Low TCDk (<40 ppm/°C), ensuring consistent circuit performance across varying temperature conditions.
-Specialized thermoset resin system and filler, delivering low TCDk, a 3.0 Dk value, ease of fabrication, and plated through-hole (PTH) process capability.
-Environmentally sustainable, with compatibility for lead-free processing and compliance with RoHS standards.
Typical Applications
With its excellent electrical performance and cost-effectiveness, this PCB is specifically engineered for use in:
-Cellular Base Station Antennas
Conclusion
This 2-layer rigid PCB, constructed from Rogers RO4730G3 antenna-grade laminate, combines strong electrical performance, cost-efficiency, and dependable manufacturability.
The inherent advantages of Rogers RO4730G3—including low dielectric loss, stable Dk, lightweight design, and lead-free compatibility—boost the PCB’s competitiveness. As a cost-effective alternative to traditional PTFE laminates, it is well-suited for cellular base station antennas and other high-frequency applications, with worldwide availability to meet the needs of global projects.
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This PCB is a high-frequency 2-layer rigid printed circuit board using Rogers RO4730G3, a premium antenna-grade laminate engineered for high-frequency applications. It leverages the material’s stable dielectric constant and low dissipation factor to ensure superior signal integrity, delivering low signal loss and consistent performance—critical for cellular base station antennas and reliable communication efficiency.
PCB Construction Details
| Item | Specifications |
| Base Material | Rogers RO4730G3 (Hydrocarbon/Ceramic/Woven Glass Composite) |
| Layer Count | 2 layers (no blind vias included) |
| Board Dimensions | 85.6mm x 103mm per unit, with a dimensional tolerance of +/- 0.15mm |
| Minimum Trace/Space | 4 mil trace width / 6 mil spacing |
| Minimum Hole Size | 0.3mm |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1 oz (equivalent to 1.4 mils) for outer copper layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Blue |
| Bottom Solder Mask | Not applied |
| Quality Control | 100% electrical testing performed before shipment |
PCB Stack-up
| Layer | Description | Thickness |
| 1 | Copper Layer 1 (Outer Top) | 35 μm |
| - | Rogers RO4730G3 Core (Dielectric Layer) | 0.508 mm (20 mil) |
| 2 | Copper Layer 2 (Outer Bottom) | 35 μm |
Artwork, Quality Standard and Availability
In terms of artwork, quality, and availability, the PCB is supplied with artwork in the Gerber RS-274-X format—an industry standard for PCB manufacturing that ensures compatibility with most mainstream production equipment. The PCB meets the IPC-Class-2 quality standard, a widely accepted benchmark that ensures consistent performance and manufacturing quality. Furthermore, this PCB is available for shipping worldwide, making it suitable for international projects.
Introduction to Rogers RO4730G3 Material
Rogers RO4730G3 is an antenna-grade laminate with a UL 94 V-0 flammability rating, composed of hydrocarbon, ceramic, and woven glass. It acts as a reliable, cost-efficient alternative to traditional PTFE-based laminates, with resin systems that provide the key properties needed for optimal antenna performance. Fully compatible with standard FR-4 processing and high-temperature lead-free soldering, RO4730G3 eliminates the need for special plated through-hole (PTH) preparation that is required for conventional PTFE materials. This makes it an economical choice for antenna applications, allowing designers to effectively balance performance and cost.
Key Features of Rogers RO4730G3 Material
| Key Features | Specifications |
| Dielectric Constant (Dk) | 3.0 +/- 0.05 at 10GHz |
| Dissipation Factor | 0.0028 at 10GHz |
| Thermal Coefficient of Dk (TCDk) | 34 ppm/°C |
| Coefficient of Thermal Expansion (CTE) | X-axis: 15.9 ppm/°C; Y-axis: 14.4 ppm/°C; Z-axis: 35.2 ppm/°C (matched to copper) |
| Glass Transition Temperature (Tg) | Greater than 280 °C |
| Decomposition Temperature (Td) | 411 °C (measured via TGA) |
| Thermal Conductivity | 0.45 W/mk |
Benefits of Rogers RO4730G3 Material
-Low-loss dielectric paired with low-profile foil, which reduces Passive Intermodulation (PIM) and minimizes insertion loss.
-Unique filler and closed microsphere structure, offering low density and a 30% weight reduction compared to PTFE/Glass alternatives.
-Low Z-axis CTE (<30 ppm/°C) and high Tg (>280°C), providing greater design flexibility and compatibility with automated assembly processes.
-Low TCDk (<40 ppm/°C), ensuring consistent circuit performance across varying temperature conditions.
-Specialized thermoset resin system and filler, delivering low TCDk, a 3.0 Dk value, ease of fabrication, and plated through-hole (PTH) process capability.
-Environmentally sustainable, with compatibility for lead-free processing and compliance with RoHS standards.
Typical Applications
With its excellent electrical performance and cost-effectiveness, this PCB is specifically engineered for use in:
-Cellular Base Station Antennas
Conclusion
This 2-layer rigid PCB, constructed from Rogers RO4730G3 antenna-grade laminate, combines strong electrical performance, cost-efficiency, and dependable manufacturability.
The inherent advantages of Rogers RO4730G3—including low dielectric loss, stable Dk, lightweight design, and lead-free compatibility—boost the PCB’s competitiveness. As a cost-effective alternative to traditional PTFE laminates, it is well-suited for cellular base station antennas and other high-frequency applications, with worldwide availability to meet the needs of global projects.
