|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This PCB is a high-performance 2-layer rigid board, constructed with strict adherence to industry standards and precise specifications to ensure reliability and functionality. It adopts Rogers TMM4 thermoset microwave material as the base material, which is suitable for RF and microwave circuitry, satellite communication systems, GPS antennas and other high-frequency applications.
PCB specification
| Item | Details |
| Base Material | Rogers TMM4 |
| Layer Count | 2 layers (no blind vias) |
| Board Dimensions | 102mm x 85mm per piece, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Finished Board Thickness | 0.5mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Silkscreen | No silkscreen on both top and bottom layers |
| Solder Mask | No solder mask on both top and bottom layers |
| Quality Control | 100% Electrical test conducted prior to shipment |
PCB Stack-up
| Layer | Specifications & Descriptions |
| Copper Layer 1 | 35 μm (1oz finished copper) |
| Rogers TMM4 Core | 0.381 mm (15 mil) core substrate |
| Copper Layer 2 | 35 μm (1oz finished copper) |
Artwork and Standard
Type of Artwork Supplied: Gerber RS-274-X, the global industry standard for PCB fabrication, compatible with mainstream manufacturing equipment and software to ensure accurate design data transfer and reduce fabrication errors.
Accepted Standard: IPC-Class-2 (formulated by IPC), a widely used PCB quality standard that ensures acceptable performance for general electronic applications with moderate reliability requirements, balancing quality and cost-effectiveness.
Availability
This PCB is available for worldwide shipping to meet global demand.
Introduction to Rogers TMM4 Base Material
Rogers TMM4 is a thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. It is specifically designed for high plated-thru-hole reliability in strip-line and micro-strip applications, integrating the advantages of both ceramic and traditional PTFE laminates without the need for specialized production techniques. As a thermoset resin-based laminate, TMM4 ensures reliable wire-bonding performance without pad lifting or substrate deformation, making it ideal for high-frequency and high-reliability applications.
Key Features of Rogers TMM4 Material
| Key Features of Rogers TMM4 Material | Specifications & Descriptions |
| Dielectric Constant (Dk) | 4.50 +/- 0.045 (stable and precise for signal transmission) |
| Dissipation Factor | 0.0020 at 10GHz (low loss, suitable for high-frequency applications) |
| Thermal Coefficient of Dk | 15 ppm/°K (stable dielectric performance across temperature variations) |
| Coefficient of Thermal Expansion (CTE) | Matched to copper; x=16 ppm/°K, y=16 ppm/°K, z=21 ppm/°K (reduces thermal stress and improves reliability) |
| Decomposition Temperature (Td) | 425 °C (TGA) (high thermal stability) |
| Thermal Conductivity | 0.7 W/mk (effective heat dissipation) |
| Moisture Absorption | 0.07% - 0.18% (low moisture absorption, ensuring performance in humid environments) |
| Available Thickness Range | 0.0015 to 0.500 inches (+/- 0.0015”) (flexible for different design requirements) |
Benefits of Using Rogers TMM4 Material
-Mechanical Properties: Resists creep and cold flow, maintaining structural integrity over time
-Chemical Resistance: Resistant to process chemicals, reducing damage during PCB fabrication
-Wire-Bonding Reliability: Thermoset resin base enables reliable wire-bonding without pad lifting or substrate deformation
-High Plated Through-Hole Reliability: Ensures stable electrical connection and long service life
-Process Compatibility: Compatible with all common printed wiring board (PWB) processes, simplifying fabrication and reducing production costs
Typical Applications
-RF and microwave circuitry
-Power amplifiers and combiners
-Filters and couplers
-Satellite communication systems
-Global Positioning Systems (GPS) Antennas
-Patch Antennas
-Dielectric polarizers and lenses
-Chip testers
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This PCB is a high-performance 2-layer rigid board, constructed with strict adherence to industry standards and precise specifications to ensure reliability and functionality. It adopts Rogers TMM4 thermoset microwave material as the base material, which is suitable for RF and microwave circuitry, satellite communication systems, GPS antennas and other high-frequency applications.
PCB specification
| Item | Details |
| Base Material | Rogers TMM4 |
| Layer Count | 2 layers (no blind vias) |
| Board Dimensions | 102mm x 85mm per piece, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Finished Board Thickness | 0.5mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Silkscreen | No silkscreen on both top and bottom layers |
| Solder Mask | No solder mask on both top and bottom layers |
| Quality Control | 100% Electrical test conducted prior to shipment |
PCB Stack-up
| Layer | Specifications & Descriptions |
| Copper Layer 1 | 35 μm (1oz finished copper) |
| Rogers TMM4 Core | 0.381 mm (15 mil) core substrate |
| Copper Layer 2 | 35 μm (1oz finished copper) |
Artwork and Standard
Type of Artwork Supplied: Gerber RS-274-X, the global industry standard for PCB fabrication, compatible with mainstream manufacturing equipment and software to ensure accurate design data transfer and reduce fabrication errors.
Accepted Standard: IPC-Class-2 (formulated by IPC), a widely used PCB quality standard that ensures acceptable performance for general electronic applications with moderate reliability requirements, balancing quality and cost-effectiveness.
Availability
This PCB is available for worldwide shipping to meet global demand.
Introduction to Rogers TMM4 Base Material
Rogers TMM4 is a thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. It is specifically designed for high plated-thru-hole reliability in strip-line and micro-strip applications, integrating the advantages of both ceramic and traditional PTFE laminates without the need for specialized production techniques. As a thermoset resin-based laminate, TMM4 ensures reliable wire-bonding performance without pad lifting or substrate deformation, making it ideal for high-frequency and high-reliability applications.
Key Features of Rogers TMM4 Material
| Key Features of Rogers TMM4 Material | Specifications & Descriptions |
| Dielectric Constant (Dk) | 4.50 +/- 0.045 (stable and precise for signal transmission) |
| Dissipation Factor | 0.0020 at 10GHz (low loss, suitable for high-frequency applications) |
| Thermal Coefficient of Dk | 15 ppm/°K (stable dielectric performance across temperature variations) |
| Coefficient of Thermal Expansion (CTE) | Matched to copper; x=16 ppm/°K, y=16 ppm/°K, z=21 ppm/°K (reduces thermal stress and improves reliability) |
| Decomposition Temperature (Td) | 425 °C (TGA) (high thermal stability) |
| Thermal Conductivity | 0.7 W/mk (effective heat dissipation) |
| Moisture Absorption | 0.07% - 0.18% (low moisture absorption, ensuring performance in humid environments) |
| Available Thickness Range | 0.0015 to 0.500 inches (+/- 0.0015”) (flexible for different design requirements) |
Benefits of Using Rogers TMM4 Material
-Mechanical Properties: Resists creep and cold flow, maintaining structural integrity over time
-Chemical Resistance: Resistant to process chemicals, reducing damage during PCB fabrication
-Wire-Bonding Reliability: Thermoset resin base enables reliable wire-bonding without pad lifting or substrate deformation
-High Plated Through-Hole Reliability: Ensures stable electrical connection and long service life
-Process Compatibility: Compatible with all common printed wiring board (PWB) processes, simplifying fabrication and reducing production costs
Typical Applications
-RF and microwave circuitry
-Power amplifiers and combiners
-Filters and couplers
-Satellite communication systems
-Global Positioning Systems (GPS) Antennas
-Patch Antennas
-Dielectric polarizers and lenses
-Chip testers
