|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
CLTE-MW laminates are ceramic-filled, woven glass reinforced PTFE composites, engineered to offer circuit designers a cost-effective, high-performance material solution. This unique laminate system is particularly well-suited for applications where thickness constraints exist due to physical or electrical requirements.
With seven available thickness options ranging from 3 mils to 10 mils, CLTE-MW™ ensures optimal signal-to-ground spacing for today's 5G and other millimeter-wave designs. A variety of copper foil options are available, including rolled, reverse-treated ED, and standard ED copper. Resistive foil and metal plate options are also available upon request.
Features and Benefits
Typical Applications
| Properties | Typical Value | Units | Test Conditions | Test Method |
| Electrical Properties | ||||
| Dielectric Constant (process) | 2.94–3.02 ±0.04 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 3.03–3.10 | – | C-24/23/50, 8–40 GHz | Microstrip Differential Phase Length |
| Dissipation Factor | 0.0015 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -35 | ppm/°C | 0–100°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 1.3×10⁷ | MΩ·cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.5×10⁶ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Dielectric Strength | 630 | V/mil | – | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 44 | kV | D-48/50 | IPC TM-650 2.5.6 |
| Comparative Tracking Index (CTI) | 600 | V | C-40/23/50 | UL-746A, ASTM D6054 |
| Thermal Properties | ||||
| Decomposition Temperature (Td) | 500 | °C | 2 hrs @ 105°C, 5% Weight Loss | IPC TM-650 2.3.40 |
| CTE (x-axis) | 8 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| CTE (y-axis) | 8 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| CTE (z-axis) | 30 | ppm/°C | – | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.42 | W/(m·K) | Z Direction | ASTM D5470 |
| Time to Delamination (T288) | >60 | minutes | 10 s @ 288°C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | ||||
| Copper Peel Strength | 1.1 (6.0) | N/mm (lbs/in) | as-received, 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD, CMD) | 113, 99 (16.4, 14.4) | MPa (ksi) | 25°C ±3°C | ASTM D790 |
| Tensile Strength (MD, CMD) | 83, 80 (12.0, 11.6) | MPa (ksi) | 23°C @ 50% RH | ASTM D3039/D3039-14 |
| Flex Modulus (MD, CMD) | 6468, 6360 (938.1, 922.4) | MPa (ksi) | 25°C ±3°C | IPC TM-650 2.4.4 |
| Dimensional Stability (MD, CMD) | 0.22, 0.22 | mil/inch | after etch + bake | IPC-TM-650 2.4.39a |
| Physical & Environmental Properties | ||||
| Flammability | V-0 | – | – | UL 94 |
| Moisture Absorption | 0.03 | % | E1/105+D48/50 | IPC TM-650 2.6.2.1 |
| Density | 2.1 | g/cm³ | C24/23/50 | ASTM D792 |
| Specific Heat Capacity | 0.93 | J/g·K | 2 hrs at 105°C | ASTM E2716 |
| NASA Outgassing (TML) | 0.03 | % | – | ASTM E595 |
| NASA Outgassing (CVCM) | <0.01 | % | – | ASTM E595 |
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
CLTE-MW laminates are ceramic-filled, woven glass reinforced PTFE composites, engineered to offer circuit designers a cost-effective, high-performance material solution. This unique laminate system is particularly well-suited for applications where thickness constraints exist due to physical or electrical requirements.
With seven available thickness options ranging from 3 mils to 10 mils, CLTE-MW™ ensures optimal signal-to-ground spacing for today's 5G and other millimeter-wave designs. A variety of copper foil options are available, including rolled, reverse-treated ED, and standard ED copper. Resistive foil and metal plate options are also available upon request.
Features and Benefits
Typical Applications
| Properties | Typical Value | Units | Test Conditions | Test Method |
| Electrical Properties | ||||
| Dielectric Constant (process) | 2.94–3.02 ±0.04 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 3.03–3.10 | – | C-24/23/50, 8–40 GHz | Microstrip Differential Phase Length |
| Dissipation Factor | 0.0015 | – | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -35 | ppm/°C | 0–100°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 1.3×10⁷ | MΩ·cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.5×10⁶ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Dielectric Strength | 630 | V/mil | – | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 44 | kV | D-48/50 | IPC TM-650 2.5.6 |
| Comparative Tracking Index (CTI) | 600 | V | C-40/23/50 | UL-746A, ASTM D6054 |
| Thermal Properties | ||||
| Decomposition Temperature (Td) | 500 | °C | 2 hrs @ 105°C, 5% Weight Loss | IPC TM-650 2.3.40 |
| CTE (x-axis) | 8 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| CTE (y-axis) | 8 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| CTE (z-axis) | 30 | ppm/°C | – | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.42 | W/(m·K) | Z Direction | ASTM D5470 |
| Time to Delamination (T288) | >60 | minutes | 10 s @ 288°C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | ||||
| Copper Peel Strength | 1.1 (6.0) | N/mm (lbs/in) | as-received, 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD, CMD) | 113, 99 (16.4, 14.4) | MPa (ksi) | 25°C ±3°C | ASTM D790 |
| Tensile Strength (MD, CMD) | 83, 80 (12.0, 11.6) | MPa (ksi) | 23°C @ 50% RH | ASTM D3039/D3039-14 |
| Flex Modulus (MD, CMD) | 6468, 6360 (938.1, 922.4) | MPa (ksi) | 25°C ±3°C | IPC TM-650 2.4.4 |
| Dimensional Stability (MD, CMD) | 0.22, 0.22 | mil/inch | after etch + bake | IPC-TM-650 2.4.39a |
| Physical & Environmental Properties | ||||
| Flammability | V-0 | – | – | UL 94 |
| Moisture Absorption | 0.03 | % | E1/105+D48/50 | IPC TM-650 2.6.2.1 |
| Density | 2.1 | g/cm³ | C24/23/50 | ASTM D792 |
| Specific Heat Capacity | 0.93 | J/g·K | 2 hrs at 105°C | ASTM E2716 |
| NASA Outgassing (TML) | 0.03 | % | – | ASTM E595 |
| NASA Outgassing (CVCM) | <0.01 | % | – | ASTM E595 |
