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| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
The F4BME275 is a precision-engineered high-frequency laminate manufactured from glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film through strictly controlled lamination processes. Compared to standard F4B materials, it delivers enhanced electrical performance including a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, positioning it as a reliable alternative to equivalent international products.
The F4BM275 and F4BME275 variants share an identical dielectric core but feature different copper foil configurations:
F4BM275 incorporates ED (electrodeposited) copper foil, ideal for applications without Passive Intermodulation (PIM) requirements.
F4BME275 utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.
By precisely adjusting the PTFE-to-glass fabric ratio, both F4BM and F4BME achieve targeted dielectric constants while maintaining low loss and superior dimensional stability. Higher dielectric constant grades contain increased glass proportions, resulting in enhanced dimensional stability, reduced coefficient of thermal expansion (CTE), and improved temperature drift characteristics, though with a marginal increase in dielectric loss.
Product Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME275 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.75 | |
| Dielectric Constant Tolerance | / | / | ±0.05 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0015 | |
| 20GHz | / | 0.0021 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -92 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >28 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 14, 16 |
| Z direction | -55 º~288ºC | ppm/ºC | 112 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.28 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.38 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
The F4BME275 is a precision-engineered high-frequency laminate manufactured from glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film through strictly controlled lamination processes. Compared to standard F4B materials, it delivers enhanced electrical performance including a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, positioning it as a reliable alternative to equivalent international products.
The F4BM275 and F4BME275 variants share an identical dielectric core but feature different copper foil configurations:
F4BM275 incorporates ED (electrodeposited) copper foil, ideal for applications without Passive Intermodulation (PIM) requirements.
F4BME275 utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.
By precisely adjusting the PTFE-to-glass fabric ratio, both F4BM and F4BME achieve targeted dielectric constants while maintaining low loss and superior dimensional stability. Higher dielectric constant grades contain increased glass proportions, resulting in enhanced dimensional stability, reduced coefficient of thermal expansion (CTE), and improved temperature drift characteristics, though with a marginal increase in dielectric loss.
Product Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME275 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.75 | |
| Dielectric Constant Tolerance | / | / | ±0.05 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0015 | |
| 20GHz | / | 0.0021 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -92 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >28 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 14, 16 |
| Z direction | -55 º~288ºC | ppm/ºC | 112 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.28 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.38 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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