|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
The F4BME265 is a high-frequency laminate manufactured through a precisely controlled process using woven glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film. Offering enhanced electrical performance compared to standard F4B materials, it features a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, making it a reliable alternative to equivalent foreign products.
The F4BM and F4BME series share an identical dielectric core but are differentiated by their copper foil type:
F4BM is paired with ED (electrodeposited) copper foil, designed for applications where Passive Intermodulation (PIM) is not a critical factor.
F4BME utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.
By precisely adjusting the ratio of PTFE resin to glass fabric, the F4BM and F4BME series achieve targeted dielectric constants while maintaining low loss and enhanced dimensional stability. Higher dielectric constant grades contain a higher proportion of glass, resulting in improved dimensional stability, a lower coefficient of thermal expansion (CTE), and better temperature drift characteristics, though with a marginal increase in dielectric loss.
Product Features
◈DK2.17～3 is optional, and DK can be customized
◈ Low loss
◈ F4BME paired with RTF copper foil provides excellent PIM performance
◈ Diverse size options for cost savings
◈ Radiation resistant, low outgassing
◈ Commercial availability, mass production capability, high cost-performance ratio
Typical Applications
◈ Microwave, Radio Frequency, Radar
◈ Phase shifters, passive components
◈ Power dividers, couplers, combiners
◈ Feed networks, phased array antennas
◈ Satellite communications, base station antennas
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME265 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.65 | |
| Dielectric Constant Tolerance | / | / | ±0.05 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0013 | |
| 20GHz | / | 0.0019 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -100 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) |
5KW,500V/s
|
KV/mm | >25 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 14, 17 |
| Z direction | -55 º~288ºC | ppm/ºC | 142 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.25 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.36 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
The F4BME265 is a high-frequency laminate manufactured through a precisely controlled process using woven glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film. Offering enhanced electrical performance compared to standard F4B materials, it features a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, making it a reliable alternative to equivalent foreign products.
The F4BM and F4BME series share an identical dielectric core but are differentiated by their copper foil type:
F4BM is paired with ED (electrodeposited) copper foil, designed for applications where Passive Intermodulation (PIM) is not a critical factor.
F4BME utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.
By precisely adjusting the ratio of PTFE resin to glass fabric, the F4BM and F4BME series achieve targeted dielectric constants while maintaining low loss and enhanced dimensional stability. Higher dielectric constant grades contain a higher proportion of glass, resulting in improved dimensional stability, a lower coefficient of thermal expansion (CTE), and better temperature drift characteristics, though with a marginal increase in dielectric loss.
Product Features
◈DK2.17～3 is optional, and DK can be customized
◈ Low loss
◈ F4BME paired with RTF copper foil provides excellent PIM performance
◈ Diverse size options for cost savings
◈ Radiation resistant, low outgassing
◈ Commercial availability, mass production capability, high cost-performance ratio
Typical Applications
◈ Microwave, Radio Frequency, Radar
◈ Phase shifters, passive components
◈ Power dividers, couplers, combiners
◈ Feed networks, phased array antennas
◈ Satellite communications, base station antennas
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME265 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.65 | |
| Dielectric Constant Tolerance | / | / | ±0.05 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0013 | |
| 20GHz | / | 0.0019 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -100 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) |
5KW,500V/s
|
KV/mm | >25 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 14, 17 |
| Z direction | -55 º~288ºC | ppm/ºC | 142 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.25 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.36 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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