logo
Japanese
ホーム 製品RF PCB板

Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish

ケビン、 板-感謝--を非常に受け取り、テストした。これらは私達が必要とした何を完全、丁度である。 rgds 金持ち

—— 豊富なRickett

ルース、 私はPCBを今日得、それらはちょうど完全である。 少し忍耐を、私の次の順序すぐに来ているとどまりなさい。 ハンブルクからの親切な点 オラフ

—— オラフKühnhold

こんにちはNatalie。 それはあなたの参照のために完全、私付けるある映像をだった。そして私は割り当てるために次のプロジェクト2つ送る。 ありがとうたくさん再度

—— セバスチャンToplisek

ケビン、 ありがとう、それらは完全になされ、よく働く。約束されるように、私の最も最近のプロジェクトのためのリンクはあなたが私のために製造したPCBsを使用して、ここにである: 見なす、 ダニエル

—— ダニエル フォード

オンラインです

Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish

Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish
Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish

大画像 :  Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish

商品の詳細:
Place of Origin: CHINA
ブランド名: Bicheng
証明: UL, ISO9001, IATF16949
お支払配送条件:
Minimum Order Quantity: 1PCS
価格: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
詳細製品概要
PCB Material: TFA300 Core - 0.254 mm (10mil) Layer Count: 2-layer
PCB Size: 65mm x 51 mm=1PCS, +/- 0.15mm PCB Thickness: 0.3mm
Copper Weight: 1oz (1.4 mils) inner/outer layers Surface Finish: Immersion Gold
Solder Mask: No Silkscreen: No
ハイライト:

Double-Sided PCB

,

10mil PCB

,

Immersion Gold Finish PCB

We are pleased to present the TFA300 double-sided PCB, a state-of-the-art solution designed for high-frequency and high-reliability applications. This PCB has been specifically engineered to meet the rigorous demands of industries such as aerospace, telecommunications, and advanced electronics, where performance and stability are paramount.

 

PCB Construction and Specifications

 

Material Composition
The TFA300 PCB is constructed using a unique composite material that combines PTFE resin with specially formulated ceramics. This innovative approach eliminates traditional glass fiber, resulting in several key advantages:

 

- Exceptional Electrical Properties: The absence of fiberglass minimizes dielectric loss, allowing for superior signal integrity.

 

- Enhanced Thermal Management: The high thermal conductivity of 0.6 W/mk ensures effective heat dissipation, maintaining optimal performance even in demanding conditions.

 

Physical Characteristics

- Layer Count: This PCB features a 2-layer construction, optimizing space while providing robust electrical performance.

 

- Dimensions: Measuring 65mm x 51mm with a precision tolerance of ±0.15mm, this PCB is compact and versatile.

 

- Finished Board Thickness: At 0.3mm, the PCB maintains structural integrity while remaining lightweight.

 

- Copper Weight: The outer layers have a finished copper weight of 1oz (1.4 mils), ensuring excellent conductivity.

 

Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish 0

 

Electrical Specifications
- Minimum Trace/Space: The design accommodates a minimum trace and space of 5/7 mils, allowing for the integration of densely packed components.

 

- Minimum Hole Size: Vias can be as small as 0.3mm, supporting advanced circuit designs.

 

- Via Plating Thickness: A plating thickness of 20 μm is utilized to ensure reliable connections between layers.

 

Quality Assurance
Manufactured to IPC-Class-2 standards, each PCB undergoes rigorous testing to ensure functionality and reliability before shipment. This commitment to quality is crucial for applications in critical environments.

 

Advanced Features

 

Dielectric Properties
The TFA300 material exhibits a dielectric constant (Dk) of 3.0±0.04 at 10GHz, making it ideal for high-frequency applications. The low dissipation factor of 0.001 at 10GHz and 0.0012 at 40GHz ensures that signal integrity is preserved, reducing losses during transmission.

 

Thermal Characteristics
The thermal coefficient of dielectric constant (TCDK) is measured at -8 ppm/°C, providing excellent stability across a wide temperature range of -55°C to 150°C. This stability is essential for applications that experience varying thermal conditions.

 

Moisture Absorption
With a moisture absorption rate of just 0.04%, the TFA300 PCB is designed to perform reliably in diverse environmental settings, minimizing the risk of degradation.

 

Typical Applications

TFA300 PCB is well-suited for a variety of applications, including:

 

- Aerospace Equipment: Ideal for in-cabin systems and crucial aerospace applications that demand high reliability.

 

- Microwaves and Antennas: Supports phase-sensitive antennas and other microwave applications requiring precise signal handling.

 

- Radar Systems: Effective for early warning and airborne radar systems, benefiting from the material’s low loss characteristics.

 

- Phased Array Antennas: Facilitates advanced beamforming networks and satellite communications, ensuring efficient signal processing.

 

- Power Amplifiers: Optimizes performance in high-power applications, enhancing overall system efficiency.

 

Conclusion
TFA300 PCB represents a significant advancement in PCB technology, offering exceptional performance and reliability for high-frequency applications. Its unique material properties, rigorous quality assurance, and versatility make it an ideal choice for engineers and designers facing the challenges of modern electronics.

 

With worldwide availability, the TFA300 PCB is ready to support your most demanding projects. For further inquiries or to place an order, please contact our sales team. We look forward to assisting you in achieving your project goals with this cutting-edge product.

 

Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish 1

連絡先の詳細
Bicheng Electronics Technology Co., Ltd

コンタクトパーソン: Ms. Ivy Deng

電話番号: 86-755-27374946

ファックス: 86-755-27374848

私達に直接お問い合わせを送信 (0 / 3000)