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TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications

TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications

MOQ: 1PCS
価格: USD9.99-99.99/PCS
標準パッケージ: Vacuum bags+Cartons
配達期間: 8-9 working days
決済方法: T/T
供給能力: 5000PCS per month
詳細情報
Place of Origin
China
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
PCB material:
TLX-8
Layer count:
2 layers
PCB thickness:
0.3mm
PCB size:
20mm x 21.35 mm=1PCS, +/- 0.15mm
Copper weight:
1oz (1.4 mils) outer layers
Solder mask:
No
Silkscreen:
No
Surface finish:
Electroless Nickel Immersion Gold (ENIG)
ハイライト:

2-layer RF PCB board

,

ENIG finish PCB

,

10mil substrate RF PCB

製品説明

Introduction to TLX-8 Material

TLX-8 is a high-volume antenna material composed of PTFE fiberglass laminates, specifically designed for reliable performance in a broad range of RF applications. Its versatility comes from various thickness options and copper cladding types, making it ideal for low layer count microwave designs. TLX-8 demonstrates mechanical reinforcement in severe environments, including:

 

- High vibration during space launches

- High temperature exposure in engine modules

- Radiation resistance for space applications

- Extreme conditions at sea for naval antennas

- Wide temperature ranges for altimeter substrates during flight

 

TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications 0

 

PCB Stack-up

The stackup of the PCB consists of:

 

- Copper Layer 1: 35 μm

- Taconic TLX-8 Core: 0.254 mm (10 mil)

- Copper Layer 2: 35 μm

 

PCB Details

Parameter Specification
Base Material TLX-8
Layer Count 2 Layers
Board Dimensions 20mm x 21.35mm ± 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.2mm
Blind Vias No
Finished Board Thickness 0.3mm
Finished Cu Weight 1oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Testing 100% electrical test prior to shipment

 

Quality Standards and Availability

This PCB adheres to IPC-Class-2 quality standards and is available for purchase worldwide.

 

Benefits of TLX-8 PCBs

- Excellent PIM Values: Measured below -160 dBc

- Mechanical & Thermal Properties: Outstanding performance in challenging environments

- Low and Stable Dielectric Constant (Dk): Provides consistent electrical performance

- Dimensionally Stable: Maintains form factor under various conditions

- Low Moisture Absorption: Enhances durability and reliability

- Tightly Controlled Dk: Ensures predictable performance

- Low Dissipation Factor (DF): Minimizes signal loss

- UL 94 V0 Rating: High flammability resistance

- Ideal for Low Layer Count Microwave Designs: Perfect for advanced RF applications

 

 

Electrical Properties

- Dielectric Constant @ 10 GHz: 2.55 ± 0.04

- Dissipation Factor @ 10 GHz: 0.0018

- Surface Resistivity (Elevated Temp): 6.605 x 10^8 Mohm

- Surface Resistivity (Humidity Conditions): 3.550 x 10^6 Mohm

- Volume Resistivity (Elevated Temp): 1.110 x 10^10 Mohm/cm

- Volume Resistivity (Humidity Conditions): 1.046 x 10^10 Mohm/cm

 

Dimensional Stability

- MD After Bake: 0.06 mm/M

- CD After Bake: 0.08 mm/M

- MD Thermal Stress: 0.09 mm/M

- CD Thermal Stress: 0.10 mm/M

 

Coefficient of Thermal Expansion (CTE)

- X: 21 ppm/°C

- Y: 23 ppm/°C

- Z: 215 ppm/°C

 

Thermal Properties

- 2% Weight Loss: 535 °C

- 5% Weight Loss: 553 °C

 

Chemical and Physical Properties

- Moisture Absorption: 0.02%

- Dielectric Breakdown: > 45 kV

- Flammability Rating: V-0

 

Typical Applications

TLX-8 PCBs are suited for various applications, including:

 

- Radar systems

- Mobile communications

- Microwave test equipment

- Microwave transmission devices

- Couplers, splitters, combiners, amplifiers, and antennas

 

With its robust construction and exceptional properties, TLX-8 is the material of choice for high-performance PCBs in demanding RF environments.

 

TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications 1

製品
商品の詳細
TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications
MOQ: 1PCS
価格: USD9.99-99.99/PCS
標準パッケージ: Vacuum bags+Cartons
配達期間: 8-9 working days
決済方法: T/T
供給能力: 5000PCS per month
詳細情報
Place of Origin
China
ブランド名
Bicheng
証明
UL, ISO9001, IATF16949
PCB material:
TLX-8
Layer count:
2 layers
PCB thickness:
0.3mm
PCB size:
20mm x 21.35 mm=1PCS, +/- 0.15mm
Copper weight:
1oz (1.4 mils) outer layers
Solder mask:
No
Silkscreen:
No
Surface finish:
Electroless Nickel Immersion Gold (ENIG)
Minimum Order Quantity:
1PCS
価格:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
ハイライト

2-layer RF PCB board

,

ENIG finish PCB

,

10mil substrate RF PCB

製品説明

Introduction to TLX-8 Material

TLX-8 is a high-volume antenna material composed of PTFE fiberglass laminates, specifically designed for reliable performance in a broad range of RF applications. Its versatility comes from various thickness options and copper cladding types, making it ideal for low layer count microwave designs. TLX-8 demonstrates mechanical reinforcement in severe environments, including:

 

- High vibration during space launches

- High temperature exposure in engine modules

- Radiation resistance for space applications

- Extreme conditions at sea for naval antennas

- Wide temperature ranges for altimeter substrates during flight

 

TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications 0

 

PCB Stack-up

The stackup of the PCB consists of:

 

- Copper Layer 1: 35 μm

- Taconic TLX-8 Core: 0.254 mm (10 mil)

- Copper Layer 2: 35 μm

 

PCB Details

Parameter Specification
Base Material TLX-8
Layer Count 2 Layers
Board Dimensions 20mm x 21.35mm ± 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.2mm
Blind Vias No
Finished Board Thickness 0.3mm
Finished Cu Weight 1oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Testing 100% electrical test prior to shipment

 

Quality Standards and Availability

This PCB adheres to IPC-Class-2 quality standards and is available for purchase worldwide.

 

Benefits of TLX-8 PCBs

- Excellent PIM Values: Measured below -160 dBc

- Mechanical & Thermal Properties: Outstanding performance in challenging environments

- Low and Stable Dielectric Constant (Dk): Provides consistent electrical performance

- Dimensionally Stable: Maintains form factor under various conditions

- Low Moisture Absorption: Enhances durability and reliability

- Tightly Controlled Dk: Ensures predictable performance

- Low Dissipation Factor (DF): Minimizes signal loss

- UL 94 V0 Rating: High flammability resistance

- Ideal for Low Layer Count Microwave Designs: Perfect for advanced RF applications

 

 

Electrical Properties

- Dielectric Constant @ 10 GHz: 2.55 ± 0.04

- Dissipation Factor @ 10 GHz: 0.0018

- Surface Resistivity (Elevated Temp): 6.605 x 10^8 Mohm

- Surface Resistivity (Humidity Conditions): 3.550 x 10^6 Mohm

- Volume Resistivity (Elevated Temp): 1.110 x 10^10 Mohm/cm

- Volume Resistivity (Humidity Conditions): 1.046 x 10^10 Mohm/cm

 

Dimensional Stability

- MD After Bake: 0.06 mm/M

- CD After Bake: 0.08 mm/M

- MD Thermal Stress: 0.09 mm/M

- CD Thermal Stress: 0.10 mm/M

 

Coefficient of Thermal Expansion (CTE)

- X: 21 ppm/°C

- Y: 23 ppm/°C

- Z: 215 ppm/°C

 

Thermal Properties

- 2% Weight Loss: 535 °C

- 5% Weight Loss: 553 °C

 

Chemical and Physical Properties

- Moisture Absorption: 0.02%

- Dielectric Breakdown: > 45 kV

- Flammability Rating: V-0

 

Typical Applications

TLX-8 PCBs are suited for various applications, including:

 

- Radar systems

- Mobile communications

- Microwave test equipment

- Microwave transmission devices

- Couplers, splitters, combiners, amplifiers, and antennas

 

With its robust construction and exceptional properties, TLX-8 is the material of choice for high-performance PCBs in demanding RF environments.

 

TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications 1

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