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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

起源の場所

ブランド名

Bicheng

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース TMM4

レイヤーカウント:

PCBの厚さ:

1.6mm

プリント基板のサイズ:

47mm×118mm(1本)±0.15mm

シルクスクリーン:

はんだマスク:

1オンス (1層あたり1.4ミル/35μmに相当)

表面仕上げ:

銀と金のメッキ（銀の上に金）

ハイライト:

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

製品説明

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

This high-performance 2-layer PCB is built with Rogers TMM4--a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.

PCB Specification

Parameter	Details
Base Material	Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
Layer Count	2-layer rigid PCB
Board Dimensions	47mm x 118mm (1 piece)±0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.35mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	1.6mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Silver and Gold Plating (Gold over Silver) - ensures corrosion resistance, reliable soldering, and long-term contact performance
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: Green; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Rogers TMM4	1.524 mm (60 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Rogers TMM4

Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials--offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4's thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.

Key Material Features

Specification	Value
Material Type	Ceramic-hydrocarbon thermoset polymer composite
Dielectric Constant (Dk)	4.50 ± 0.045
Dissipation Factor (tanδ) @ 10 GHz	0.0020
Thermal Coefficient of Dk (TCDk)	15 ppm/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
Decomposition Temperature (Td, TGA)	425 °C
Thermal Conductivity	0.7 W/mK
Moisture Absorption	0.07% - 0.18%
Available Thickness Range	0.0015 - 0.500 inches (±0.0015 inches)
CTE Compatibility	Matched to copper

Core Benefits

Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation--critical for high-precision RF/microwave components.
High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.

Typical Applications

This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:

RF and Microwave Circuitry
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers

タグ:

製品

MOQ:	1個
価格:	USD9.99-99.99
標準パッケージ:	真空バッグ+カートン
配達期間:	8-9営業日
決済方法:	T/T
供給能力:	1か月あたり5000pcs

詳細情報

製品説明

詳細情報

起源の場所

中国

ブランド名

Bicheng

証明

UL, ISO9001, IATF16949

モデル番号

BIC-332.V1.0

基本材料:

ロジャース TMM4

レイヤーカウント:

2層

PCBの厚さ:

1.6mm

プリント基板のサイズ:

47mm×118mm(1本)±0.15mm

シルクスクリーン:

白

はんだマスク:

緑

銅重量:

1オンス (1層あたり1.4ミル/35μmに相当)

表面仕上げ:

銀と金のメッキ（銀の上に金）

最小注文数量:

1個

価格:

USD9.99-99.99

パッケージの詳細:

真空バッグ+カートン

受渡し時間:

8-9営業日

支払条件:

T/T

供給の能力:

1か月あたり5000pcs

ハイライト

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

製品説明

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

PCB Specification

Parameter	Details
Base Material	Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
Layer Count	2-layer rigid PCB
Board Dimensions	47mm x 118mm (1 piece)±0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.35mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	1.6mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Silver and Gold Plating (Gold over Silver) - ensures corrosion resistance, reliable soldering, and long-term contact performance
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: Green; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Rogers TMM4	1.524 mm (60 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Rogers TMM4

Key Material Features

Specification	Value
Material Type	Ceramic-hydrocarbon thermoset polymer composite
Dielectric Constant (Dk)	4.50 ± 0.045
Dissipation Factor (tanδ) @ 10 GHz	0.0020
Thermal Coefficient of Dk (TCDk)	15 ppm/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
Decomposition Temperature (Td, TGA)	425 °C
Thermal Conductivity	0.7 W/mK
Moisture Absorption	0.07% - 0.18%
Available Thickness Range	0.0015 - 0.500 inches (±0.0015 inches)
CTE Compatibility	Matched to copper

Core Benefits

Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation--critical for high-precision RF/microwave components.
High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.

Typical Applications

This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:

RF and Microwave Circuitry
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers

タグ:

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PCBのステンシル

金属の中心PCB

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

1oz RF PCB Board,

1.6mm RF PCB Board,

RF PCB板

ロジャースPCB板

PTFE PCB板

高いTg PCB

多層PCB

Taconic PCB

HDI PCB板

高速PCB

インピーダンスはPCBを制御した

適用範囲が広いPCB板

fr4 PCB板

PCBのステンシル

金属の中心PCB

Double-layer RF PCB board

1.6mm TMM4 PCB

Silver and gold plated PCB

1oz RF PCB Board,

1.6mm RF PCB Board,