|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This double-sided PCB utilizes AD300D as its core substrate and incorporates an EPIG (nickel-free) surface finish. Configured with 1oz (1.4 mils) copper cladding on the outer layers, a finished board thickness of 1.2mm, and 20 μm via plating, the PCB delivers consistent electrical performance and high-precision manufacturing uniformity, making it highly suitable for applications including cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas.
PCB Construction Details
| Specifications | Details |
| Base material | AD300D |
| Layer count | Double sided PCB |
| Board dimensions | 67mm x 102.6mm per unit, +/- 0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | No Blind vias |
| Finished board thickness | 1.2mm |
| Finished Cu weight | 1 oz (1.4 mils) on outer layers |
| Via plating thickness | 20 μm |
| Surface finish | EPIG (nickel free) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Quality control | 100% Electrical test used prior to shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| AD300D Core | 1.016 mm (40mil) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB fabrication adheres to the Gerber RS-274-X standard, the industry-accepted protocol for transmitting PCB manufacturing data.
Quality Standard
This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard establishes parameters for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications requiring consistent operation and moderate dependability.
Global Availability
This PCB is available for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to accommodate the requirements of both small-batch and large-volume orders.
Introduction to AD300D Base Material
AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials engineered to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. Manufactured to meet the demands of today’s wireless antenna markets, this PTFE resin-based material is compatible with standard PTFE fabrication processes and provides a cost-effective construction that enhances both electrical and mechanical performance.
Key Features of AD300D
| Key Features | Specifications |
| Dielectric Constant (Dk) | 2.94 at 10GHz/23°C |
| Dissipation Factor | 0.0021 at 10GHz/23°C |
| Coefficient of Thermal Expansion (CTE) | 24 ppm/°C (X-axis), 23 ppm/°C (Y-axis), 98 ppm/°C (Z-axis) (-55 to 288°C) |
| Thermal Coefficient of Dielectric Constant | -73 ppm/°C |
| Flame Retardant Rating | UL 94 V-0 |
Benefits
Typical Applications
Conclusion
This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas. Leveraging the high-performance AD300D substrate, this PCB serves as a reliable and high-quality solution for high-demand wireless applications requiring stable electrical performance, low loss, and excellent PIM performance.
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This double-sided PCB utilizes AD300D as its core substrate and incorporates an EPIG (nickel-free) surface finish. Configured with 1oz (1.4 mils) copper cladding on the outer layers, a finished board thickness of 1.2mm, and 20 μm via plating, the PCB delivers consistent electrical performance and high-precision manufacturing uniformity, making it highly suitable for applications including cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas.
PCB Construction Details
| Specifications | Details |
| Base material | AD300D |
| Layer count | Double sided PCB |
| Board dimensions | 67mm x 102.6mm per unit, +/- 0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | No Blind vias |
| Finished board thickness | 1.2mm |
| Finished Cu weight | 1 oz (1.4 mils) on outer layers |
| Via plating thickness | 20 μm |
| Surface finish | EPIG (nickel free) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Quality control | 100% Electrical test used prior to shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| AD300D Core | 1.016 mm (40mil) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB fabrication adheres to the Gerber RS-274-X standard, the industry-accepted protocol for transmitting PCB manufacturing data.
Quality Standard
This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard establishes parameters for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications requiring consistent operation and moderate dependability.
Global Availability
This PCB is available for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to accommodate the requirements of both small-batch and large-volume orders.
Introduction to AD300D Base Material
AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials engineered to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. Manufactured to meet the demands of today’s wireless antenna markets, this PTFE resin-based material is compatible with standard PTFE fabrication processes and provides a cost-effective construction that enhances both electrical and mechanical performance.
Key Features of AD300D
| Key Features | Specifications |
| Dielectric Constant (Dk) | 2.94 at 10GHz/23°C |
| Dissipation Factor | 0.0021 at 10GHz/23°C |
| Coefficient of Thermal Expansion (CTE) | 24 ppm/°C (X-axis), 23 ppm/°C (Y-axis), 98 ppm/°C (Z-axis) (-55 to 288°C) |
| Thermal Coefficient of Dielectric Constant | -73 ppm/°C |
| Flame Retardant Rating | UL 94 V-0 |
Benefits
Typical Applications
Conclusion
This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas. Leveraging the high-performance AD300D substrate, this PCB serves as a reliable and high-quality solution for high-demand wireless applications requiring stable electrical performance, low loss, and excellent PIM performance.
