|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This 2-layer rigid printed circuit board (PCB) utilizes RF-60A as its core substrate and incorporates a 100 uinch Pure Gold Plating surface finish. Featuring a 1oz (1.4 mils) copper weight on the outer layers, a final board thickness of 1.5mm, and a via plating thickness of 20 μm, this PCB delivers consistent electrical performance and high-precision manufacturing standards, making it highly applicable for power amplifiers, filters, and other high-frequency electronic devices.
PCB Specifications
| Specifications | Details |
| Base material | RF-60A |
| Layer count | 2 layers |
| Board dimensions | 87mm x 29mm per unit, +/- 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | Blind vias are not incorporated |
| Finished board thickness | 1.5mm |
| Finished Cu weight | 1 oz (1.4 mils) for outer layers |
| Via plating thickness | 20 μm |
| Surface finish | 100 uinch Pure Gold Plating |
| Top Silkscreen | Not applied |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Not applied |
| Bottom Solder Mask | Not applied |
| Quality control | 100% electrical testing is performed prior to shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| RF-60A | 1.27 mm (50mil) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB fabrication adheres to the Gerber RS-274-X format, which serves as the industry-standard protocol for transmitting PCB manufacturing data.
Quality Standard
This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. IPC-Class-2 establishes requirements for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications that require consistent performance and moderate reliability.
Availability
This PCB is available worldwide. We provide reliable logistics and shipping solutions to ensure prompt delivery to customers across various countries and regions, accommodating both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global technology firms, we offer consistent supply and professional after-sales assistance to meet diverse market demands.
Introduction to RF-60A Base Material
RF-60A is an organic-ceramic laminate belonging to the ORCER product family by Taconic, featuring woven glass reinforcement. It is developed based on Taconic's expertise in both ceramic fill technology and coated PTFE fiberglass. RF-60A demonstrates exceptional interlaminar bond strength and solder resistance, with its proprietary composition ensuring low moisture absorption and uniform electrical properties. The woven glass reinforcement of RF-60A guarantees excellent dimensional stability and improves flexural strength, while its low Z-axis expansion ensures plated-through-hole reliability in extreme thermal environments.
Key Features of RF-60A
| Key Features | Specifications |
| Dielectric Constant (Dk) | 6.15 at 10 GHz |
| Dissipation Factor | 0.0038 at 10 GHz/23°C |
| Moisture Absorption | 0.02% |
| Thermal Conductivity | 0.4 W/MK |
| Coefficient of Thermal Expansion (CTE) | 9 ppm/°C (X-axis), 8 ppm/°C (Y-axis), 69 ppm/°C (Z-axis) |
| Outgassing | 0.02% TML, 0.01% WVR |
Benefits
Typical Applications
Conclusion
This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of power amplifiers, filters, miniaturized antennas, and passive components. Leveraging the high-performance RF-60A substrate, this PCB serves as a reliable and high-quality solution for high-demand electronic applications requiring stable electrical performance and structural integrity.
|
|
| MOQ: | 1個 |
| 価格: | USD9.99-99.99 |
| 標準パッケージ: | 真空袋+カートン |
| 配達期間: | 8～9営業日 |
| 決済方法: | T/T |
| 供給能力: | 5000PCS/月 |
This 2-layer rigid printed circuit board (PCB) utilizes RF-60A as its core substrate and incorporates a 100 uinch Pure Gold Plating surface finish. Featuring a 1oz (1.4 mils) copper weight on the outer layers, a final board thickness of 1.5mm, and a via plating thickness of 20 μm, this PCB delivers consistent electrical performance and high-precision manufacturing standards, making it highly applicable for power amplifiers, filters, and other high-frequency electronic devices.
PCB Specifications
| Specifications | Details |
| Base material | RF-60A |
| Layer count | 2 layers |
| Board dimensions | 87mm x 29mm per unit, +/- 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | Blind vias are not incorporated |
| Finished board thickness | 1.5mm |
| Finished Cu weight | 1 oz (1.4 mils) for outer layers |
| Via plating thickness | 20 μm |
| Surface finish | 100 uinch Pure Gold Plating |
| Top Silkscreen | Not applied |
| Bottom Silkscreen | Not applied |
| Top Solder Mask | Not applied |
| Bottom Solder Mask | Not applied |
| Quality control | 100% electrical testing is performed prior to shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| RF-60A | 1.27 mm (50mil) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB fabrication adheres to the Gerber RS-274-X format, which serves as the industry-standard protocol for transmitting PCB manufacturing data.
Quality Standard
This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. IPC-Class-2 establishes requirements for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications that require consistent performance and moderate reliability.
Availability
This PCB is available worldwide. We provide reliable logistics and shipping solutions to ensure prompt delivery to customers across various countries and regions, accommodating both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global technology firms, we offer consistent supply and professional after-sales assistance to meet diverse market demands.
Introduction to RF-60A Base Material
RF-60A is an organic-ceramic laminate belonging to the ORCER product family by Taconic, featuring woven glass reinforcement. It is developed based on Taconic's expertise in both ceramic fill technology and coated PTFE fiberglass. RF-60A demonstrates exceptional interlaminar bond strength and solder resistance, with its proprietary composition ensuring low moisture absorption and uniform electrical properties. The woven glass reinforcement of RF-60A guarantees excellent dimensional stability and improves flexural strength, while its low Z-axis expansion ensures plated-through-hole reliability in extreme thermal environments.
Key Features of RF-60A
| Key Features | Specifications |
| Dielectric Constant (Dk) | 6.15 at 10 GHz |
| Dissipation Factor | 0.0038 at 10 GHz/23°C |
| Moisture Absorption | 0.02% |
| Thermal Conductivity | 0.4 W/MK |
| Coefficient of Thermal Expansion (CTE) | 9 ppm/°C (X-axis), 8 ppm/°C (Y-axis), 69 ppm/°C (Z-axis) |
| Outgassing | 0.02% TML, 0.01% WVR |
Benefits
Typical Applications
Conclusion
This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of power amplifiers, filters, miniaturized antennas, and passive components. Leveraging the high-performance RF-60A substrate, this PCB serves as a reliable and high-quality solution for high-demand electronic applications requiring stable electrical performance and structural integrity.
