15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

This high-performance 2-layer rigid printed circuit board (PCB) is meticulously engineered using Rogers' TMM6 thermoset microwave material--a ceramic-thermoset polymer composite optimized for stripline and microstrip applications--to meet stringent electrical, thermal, and mechanical standards, making it ideal for a wide range of high-frequency RF, microwave, and communication systems.

The 2-layer stack-up is precisely designed to maximize the performance advantages of Rogers TMM6 material, with clear layer functions and thicknesses:

Artwork Format: Gerber RS-274-X, the industry-standard PCB fabrication format, ensuring compatibility and reducing fabrication errors.

Quality Standard: Complies with IPC-Class 2, meeting the reliability requirements of commercial and industrial high-frequency applications--ensures consistent performance under normal operating conditions and environmental variations.

Availability: Worldwide shipping.

As a ceramic-thermoset polymer composite tailored for microwave applications, Rogers TMM6 possesses unique properties that form the foundation of the PCB's high performance:

• Dielectric Constant (Dk): 6.0 ± 0.08 at 10GHz, with tight tolerance to ensure predictable signal propagation--critical for designing precise RF/microwave components such as filters and couplers.
• Dissipation Factor (Df): 0.0023 at 10GHz, ultra-low loss to minimize signal attenuation--maintains signal integrity even in long trace routes, which is essential for high-frequency communication systems.
• Thermal Coefficient of Dk: -11 ppm/°K, minimizing Dk drift caused by temperature changes--ensures stable performance in environments with fluctuating temperatures (such as outdoor communication equipment or satellite systems).

• Decomposition Temperature (Td): 425°C (TGA), withstanding high temperatures generated by power dissipation (e.g., in power amplifiers) and reflow soldering processes--prevents material degradation under extreme heat.
• Coefficient of Thermal Expansion (CTE): 18 ppm/K (x-axis), 18 ppm/K (y-axis), 26 ppm/K (z-axis), matching the CTE of copper--avoids delamination between copper layers and TMM6 core during thermal cycling, enhancing structural stability.
• Thermal Conductivity: 0.72 W/mK, efficiently dissipating heat from high-power components--reduces thermal hotspots and extends the service life of sensitive RF devices.
• Mechanical Strength: Resists creep and cold flow, maintaining dimensional stability under mechanical stress--suitable for rugged applications such as automotive GPS antennas or aerospace communication modules.

• Process Compatibility: Compatible with all common PCB manufacturing processes (including etching, drilling, and plating), eliminating the need for specialized production techniques--reducing manufacturing costs and lowering technical barriers.
• Chemical Resistance: Resistant to process chemicals (such as etchants and cleaning agents), minimizing material damage during fabrication and reducing reject rates.
• Wire-Bonding Reliability: Based on thermoset resin, enabling stable wire bonding for RF chips--ensures reliable high-frequency signal transfer between chips and the PCB, which is critical for microwave circuit performance.

• RF and microwave circuitry
• Power amplifiers and combiners
• Filters and coupler
• Satellite communication systems
• Global Positioning Systems Antennas
• Patch Antennas
• Dielectric polarizers and lenses
• Chip testers