品質 RF PCB板 & ロジャースPCB板 工場

September 15 News – Recently, China’s Ministry of Commerce has initiated an anti-discrimination investigation into U.S. chip trade policies and a separate inquiry into dumping practices.   The first investigation will examine whether Washington has discriminated against Chinese companies in its chip trade policies. The second will focus on alleged dumping of certain U.S. analog chips used in devices such as hearing aids, Wi-Fi routers, and temperature sensors. In a statement, the ministry noted that in recent years, the U.S. has imposed a series of restrictions on China regarding chips, including trade discrimination investigations and export controls.   It added that such "protectionist" practices are alleged to discriminate against China and aim to curb and suppress the development of high-tech industries in China, such as advanced computing chips and artificial intelligence.   A spokesperson for the Ministry of Commerce stated in response to media inquiries that the anti-dumping investigation was initiated upon the application of China’s domestic industry and complies with Chinese laws, regulations, and WTO rules. The investigation involves general-purpose interface and gate driver chips imported from the U.S.   The spokesperson mentioned that preliminary evidence submitted by the applicant shows that from 2022 to 2024, the volume of the investigated products imported from the U.S. increased by 37%, while the import price decreased by 52%. This has suppressed and driven down domestic product prices, causing harm to the production and operations of the domestic industry.   The spokesperson added that after receiving the application, the investigating authority reviewed it in accordance with the law and determined that it met the conditions for initiating an anti-dumping investigation. The authority will conduct the investigation in accordance with legal procedures, fully safeguard the rights of all interested parties, and make an objective and fair ruling based on the investigation results.   The spokesperson also stated that recently, the U.S. government has broadly defined national security concepts, abused export controls and "long-arm jurisdiction," and imposed malicious blockades and suppression on China’s chip products and artificial intelligence industry. These actions seriously violate WTO rules and undermine the legitimate rights and interests of Chinese companies, to which China firmly objects.   General-purpose interface chips are integrated circuit chips designed to provide diverse interface types for connecting various devices, systems, or components to achieve efficient data transmission and signal conversion. Gate driver chips are integrated circuit chips used to enhance the output of gate control signals from controllers and manage the switching on and off of power semiconductor devices.   ----------------------------------------- Source: Guoxin Network Disclaimer: We respect originality and value sharing. The copyrights of texts and images belong to the original authors. The purpose of reposting is to share more information, and this does not imply our endorsement of the views. If there are any infringements, please contact us, and we will delete them as soon as possible. Thank you.

On September 10, Beijing time, Apple officially unveiled four new models: the iPhone 17, iPhone Air, iPhone 17 Pro, and iPhone 17 Pro Max, with starting prices in China set at 5,999 yuan. Among the newly launched iPhone 17 Pro series, the orange, blue, and silver color variants are manufactured at Foxconn's Zhengzhou Port Area facility.   The Zhengzhou Port Area is currently in the mass production ramp-up phase for the iPhone 17 series. As production scales up, the demand for labor continues to grow. Reports indicate that "Foxconn has recruited more workers this year compared to last year." "In August, the referral bonus peaked at 9,800 yuan. During the high-demand period, tens of thousands of workers were hired daily, with the hiring surge lasting an entire week."   Temporary workers, particularly those referred through bonus programs, form a significant part of the workforce. These "referral bonus workers" receive an additional payout upon completing a specified employment period. Combined with their regular wages, they can typically save over 20,000 yuan within three months. In addition to these workers, Foxconn also employs hourly temporary workers.   During Apple's annual fall product launch cycle, the Zhengzhou Port Area factory enters its busiest period of the year. The demand for temporary workers spikes, driving referral bonuses higher. By late June, bonuses rose from 4,800 yuan to 5,000 yuan within three days. In late July, they exceeded 8,000 yuan, reaching a peak of 9,800 yuan in August before dipping to 7,300 yuan by month-end. In early September, bonuses quickly rebounded, surpassing 9,000 yuan and returning to high levels.   On the production floor, nearly 200,000 workers operate in two shifts, handling tasks such as screw fastening, film application, and component assembly. Conveyor belts continuously transport finished iPhone 17 units to the packaging workshop, where they are placed into white boxes bearing the Apple logo.   However, this workforce size is not the facility's historical peak. "At its highest, the facility employed up to 400,000 people. Apple was even more popular back then, and Foxconn was the primary manufacturer. Now, orders are more distributed, and Foxconn is no longer the sole producer," noted a source. Staff at the port area's human resources service center also confirmed, "Recently, thousands of workers have been entering daily—the volume is immense."   A long-term Foxconn employee with over a decade of experience mentioned that these temporary workers typically have contracts lasting only two to three months, aligning with the critical production ramp-up phase for Apple's new products. After this period, once production targets are met and order demand stabilizes, the facility gradually begins scaling down production lines.   A Foxconn Group HR manager stated that since August, overtime intensity has increased significantly. "Overtime work has surged dramatically, unlike last year's pace." Future production rhythms will depend on market conditions following the new product launch.   ------------------------------------- Source: Guoxin Network Disclaimer: We respect originality and value sharing. The copyrights of texts and images belong to the original authors. The purpose of reposting is to share more information, which does not imply endorsement of the views. If any infringement occurs, please contact us, and we will delete the content promptly. Thank you.

TP1020などの高周波PCBは、10GHz以上で動作するアプリケーションで最適な性能を確保するために、一連の特殊な製造プロセスを必要とします。標準的なFR-4ベースのPCBとは異なり、これらの高性能基板は、電気的完全性、寸法安定性、および材料特性を維持するために、すべての製造段階で細心の注意を払う必要があります。   材料の取り扱いと準備 TP1020—ガラス繊維強化材を含まないセラミック充填ポリフェニレンオキシド（PPO）樹脂—のような高周波材料の独自の組成は、特殊な取り扱いプロトコルを必要とします。ラミネート加工の前に、原材料は湿度レベルが30％以下で、温度が23±2℃に保たれた制御された環境に保管する必要があります。これにより、吸湿を防ぎます（TP1020の最大吸収率0.01％を考慮すると重要です）。吸湿は、10GHzで±0.2を超える誘電率の変動を引き起こす可能性があります。   切断およびトリミング作業には、標準的な超硬ブレードではなく、ダイヤモンドチップ工具が必要です。TP1020にはガラス繊維強化材が含まれていないため、過度の機械的応力が加わると欠けやすく、信号の完全性を損なう可能性のある微細な亀裂が発生する可能性があります。レーザー切断は、より高価ですが、小型アンテナで使用される31mm x 31mmの基板に必要な±0.15mmの寸法公差を達成するために好まれます。   ラミネート加工とコア処理 高周波ラミネートは、誘電率の一貫性を維持するために、正確なラミネート加工パラメータを必要とします。TP1020の場合、ラミネート加工プロセスは190±5℃で200±10 psiの圧力をかけて行われます。これは、ガラス繊維強化材に使用される300+ psiよりも大幅に低くなっています。この低い圧力により、PPOマトリックス内のセラミック粒子の変位が防止され、ターゲットの誘電率10.2が基板全体で維持されます。   TP1020 PCBの4.0mmコア厚さは、ラミネート加工中の滞留時間を長くする必要があります—通常90分で、標準基板の45分と比較します。この制御された加熱サイクルにより、内部ボイドを生成することなく完全な樹脂の流れが確保されます。内部ボイドは、高周波で信号反射点として機能します。ラミネート加工後の冷却は、TP1020のCTEが40ppm/°C（X/Y軸）であることを管理するために不可欠であり、熱応力を最小限に抑えるために、1分あたり2℃の速度で進行する必要があります。 穴あけとメッキ技術 高周波PCBの穴あけは、TP1020などの材料に含まれるセラミックフィラーの研磨性のため、特有の課題を提示します。標準的なツイストドリルは早期に摩耗し、5μmを超える穴壁粗さ—高周波信号パスには許容できません。代わりに、130°の先端角を持つダイヤモンドコーティングされたドリルビットを使用して、壁粗さ

プリント回路板 (PCB) の複雑な構造の中で 隠れた金属の点や多角形のように見えるパッドは 回路の寿命を維持する上で 重要な役割を果たします電子部品との間の"橋"としてパッドの設計と性能は 電子機器全体の安定性,信頼性,使用寿命を直接決定し,その重要性は 目に見えるものよりもはるかに大きい.   接続機能の観点から,パッドは電気伝導を達成するためのコアキャリアです.部品が溶接プロセスを通じてPCBに固定されると,パッドは,溶けた溶接液を介して部品ピンで伝導経路を形成するシンプルなレジスタンスやコンデンサータであれ,複雑な集積回路であれ,電流と信号を1つのコンポーネントから別のコンポーネントに伝達し,最終的に完全な回路システムを形成します.PCBとの電気接続を確立するためにパッドに依存する必要があります.パッドが脱落したり 酸化したり 設計上の欠陥がある場合 オープン・サーキットやショート・サーキットなどの欠陥が発生し 直接的に回路の機能障害を引き起こします   メカニカルなサポートの観点から,パッドも代替不可能な役割を果たします. 溶接プロセス中に,溶接が固くなった後,それはPCB表面にコンポーネントをしっかり固定します.溶接剤と密接な組み合わせによって, 振動,衝撃,または温度変化などの環境要因の影響下で移動または落ちることを防止して,部品の安定した機械的サポートを提供します.特に大きく重い部品 (トランスフォーマー,コネクタなど) の場合,パッドのサイズ,形状,配布設計は,部品の設置強度に直接影響します.装置の機械的抵抗性能に関係する.   パッド設計の合理性は回路の性能に大きな影響を与えます.高周波回路では,パッドの大きさ,形状,距離がインピーダンスのマッチングと信号の整合に影響します.過剰に大きいパッドは寄生虫容量の増加につながる可能性がありますパッドは電源回路において,十分な電流容量を持つ必要がある. パッドは,電流容量によって,電流を伝達し,電流を伝達し,電流を伝達し,電流を伝達し,電流を伝達する.面積が不十分ならオーバーヒートし,回路を燃やします. さらに,電流は,電流のパッドとワイヤーの接続方法 (例えば,涙滴の設計を採用するかどうか) は,PCBの疲労耐性にも影響します.熱膨張と収縮によるワイヤ断裂のリスクを軽減する.   製造の観点からすると,パッドの設計は,溶接プロセスの実行可能性と効率性と直接関係しています.   標準化されたパッドのサイズと間隔は,自動溶接機器 (配置機械,波溶接炉など) に適応し,溶接欠陥の割合を減らすことができます.適正 な パッド の 配置 は,溶接 橋 と 冷たい 溶接 の よう な 問題 を 避け ます同時に,パッドの塗装品質 (金塗装,チンの塗装など) は,溶接の湿度と信頼性に影響します.製品に適格性や使用寿命が決まる.   簡単に言うと,パッドは,PCB内の電力と機械を接続するコアハブです.その重要性は,回路の伝導性を維持するなど複数の次元に反映されています.構造的安定を確保する電子機器の小型化,高周波,高信頼性の発展傾向により,パッドの設計と製造プロセスは,製品の競争力を決定する重要な要因の1つになります"小さな部品が大きな機能"の重要な役割を常に果たしています

AI眼鏡はウェアラブル市場における 新しい需要を急速に推進しています メタやアップルのような 大手国際企業は 製品発売を加速しています中国でも多くのスタートアップが参加していますセンサーとレンズモジュールを含むAIメガネのサプライチェーンが新しい勢いを生み出し,HDI,柔軟性回路板,硬性-フレックスボード,および基板メーカーに恩恵を与えています.AIメガネをウェアラブルデバイスの フォーカルポイントにする.   現在,HUATONGはAI眼鏡のアプリケーションのための中高級HDIボードに焦点を当て,同時に柔軟性のあるおよび硬性のあるフレックスボードを開発し,完全な製品ラインナップを作成しています.現行出荷は収入に大きく貢献していないが顧客には,Metaなどのいくつかの国際ブランドがあり,中国の多くのスタートアップが積極的にAIメガネを開発しています.AIメガネの軽量でコンパクトな性質により,高級印刷回路板の需要が増加しています高級アプリケーションのシェアを拡大するのに有利である.   Zhen Dingは,スマートメガネ分野に入ってきた最初のPCBメーカーの一つであり,現在は柔軟なボード,SiPモジュール,硬いボードを含む完全な製品ラインを提供しています.スマートメガネに使われる印刷回路板のグローバル市場シェアは 30~50%に達したとZhen Dingは報告しています今年の出荷はピークに達していないが,昨年の数倍に増加した. 高度の技術的障壁とプレミアム価格,この事業の毛利は,すでに会社の平均以上で,収益性がさらに向上すると予想されています.   台湾のJeng Yiは近年,ウェアラブルデバイス市場に積極的に参入しており,AI眼鏡の新世代の製品が大量生産を開始しました.初期の成果が徐々に2026年には 輸送量が大幅に増加すると予測し 事業の勢いをさらに高めます   上流材料ではPIメーカーダマオは透明PIのMetaグラスをターゲットとしています.ダマオはフィルムを提供し,その子会社ボミランは細い回路に特化したスマートメガネが眼の追跡機能を実現できるようにする同社はAI眼鏡市場における戦略的ポジションを継続する計画です   ほら ほら 源:マネーDJ 免責事項: 当社はオリジナリティを尊重し,共有に重点を置いています. テキストと画像はオリジナルの著者の著作権で保護されています.再印刷 の 目的 は,より多くの 情報 を 共有 する こと で あり,我々の 立場 を 表わす こと で は あり ませ ん.権利が侵害された場合は, 迅速に連絡してください.

Introduction The F4BTMS series is an upgraded version of the F4BTM series. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants.   The incorporation of ultra-thin, ultra-fine fiberglass cloth reinforcement, along with a precise blend of special nanoceramics and polytetrafluoroethylene resin, minimizes electromagnetic wave interference, reducing dielectric loss and enhancing dimensional stability.   F4BTMS exhibits reduced anisotropy in the X/Y/Z directions, enabling higher frequency usage, increased electrical strength, and improved thermal conductivity.   Features F4BTMS material offers a wide range of dielectric constants, providing flexible options from 2.2 to 10.2, while maintaining a stable value throughout.   Its dielectric loss is extremely low, ranging from 0.0009 to 0.0024, minimizing energy dissipation and improving overall system efficiency.   F4BTMS exhibits excellent temperature coefficient of dielectric constant. The TCDK with a DK value ranging from 2.55 to 10.2, remains within 100 ppm/℃.   The CTE values in the X and Y directions are between 10-50 ppm/°C , while in the Z direction, it is as low as 20-80 ppm/°C. This low thermal expansion ensures exceptional dimensional stability, enabling reliable hole copper connections.   F4BTMS demonstrates remarkable resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation; and low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.   PCB capability We offer a wide range of PCB manufacturing capabilities, allowing you to choose the best options for your needs.   We can accommodate various layer counts, including Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   You can select from different copper weights, such as 1oz (35µm) and 2oz (70µm).   We offer a diverse selection of dielectric thicknesses, ranging from 0.09mm (3.5mil) to 6.35mm (250mil).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, catering to designs of different scales.   Various solder mask colors are available, such as Green, Black, Blue, Yellow, Red, and more.   Moreover, we provide diverse surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.   PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz) F4BTMS220 2.2±0.02 0.0009 F4BTMS233 2.33±0.03 0.0010 F4BTMS255 2.55±0.04 0.0012 F4BTMS265 2.65±0.04 0.0012 F4BTMS294 2.94±0.04 0.0012 F4BTMS300 3.0±0.04 0.0013 F4BTMS350 3.5±0.05 0.0016 F4BTMS430 4.3±0.09 0.0015 F4BTMS450 4.5±0.09 0.0015 F4BTMS615 6.15±0.12 0.0020 F4BTMS1000 10.2±0.2 0.0020 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications F4BTMS PCBs have extensive applications across various domains, including Aerospace and aviation equipment, Microwave and RF applications, Radar systems, Signal distribution feed networks, Phase-sensitive antennas and phased array antennas etc.

Introduction Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. Features The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range. For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance. The material exhibits radiation resistance and displays low outgassing properties. Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating. PCB Capability Let’s see our PCB Capability on TP materials. Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material. Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements. Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications. Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm. Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction. Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements. PCB Material: Polyphenylene, ceramic Designation (TP Series) Designation DK DF TP300 3.0±0.06 0.0010 TP440 4.4±0.09 0.0010 TP600 6.0±0.12 0.0010 TP615 6.15±0.12 0.0010 TP920 9.2±0.18 0.0010 TP960 9.6±0.2 0.0011 TP1020 10.2±0.2 0.0011 TP1100 11.0±0.22 0.0011 TP1600 16.0±0.32 0.0015 TP2000 20.0±0.4 0.0020 TP2200 22.0±0.44 0.0022 TP2500 25.0±0.5 0.0025 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤150mm X 220mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.

Introduction Wangling’s TF laminates are a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. These laminates are free from fiberglass cloth and the dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. With the application of special production processes, they demonstrate outstanding dielectric performance and offer a high level of reliability. Features TF laminates exhibit a stable and wide range of dielectric constant, which ranges from 3 to 16, with common values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16. TF laminates feature exceptionally low dissipation factor, with loss tangent values of 0.0010 for DK ranging from 3.0 to 9.5 at 10GHz, 0.0012 for DK from 9.6 to 11.0 at 10GHz, and 0.0014 for DK spanning 11.1 to 16.0 at 5GHz. With a long-term working temperature surpassing TP materials, they can operate within a wide range of -80°C to +200°C The laminates come in thickness options ranging from 0.635mm to 2.5mm, catering to various design requirements. They boast resistance to radiation and exhibit low outgassing properties. PCB Capability We provide a comprehensive range of PCB manufacturing capabilities to fulfill your specific requirements. At first, we can accommodate both Single Sided and Double Sided PCBs. Then you have the option to select from different copper weights, such as 1oz (35µm) and 2oz (70µm), to meet your conductivity needs. A diverse selection of dielectric thicknesses are available in our house, ranging from 0.635mm to 2.5mm. Our manufacturing capabilities support PCB sizes up to 240mm X 240mm and various solder mask colours like Green, Black, Blue, Yellow, Red, and more. Additionally, we offer various surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, and ENEPIG etc. PCB Material: Polyphenylene, ceramic Designation (TF Series) Designation DK DF TF300 3.0±0.06 0.0010 TF440 4.4±0.09 0.0010 TF600 6.0±0.12 0.0010 TF615 6.15±0.12 0.0010 TF920 9.2±0.18 0.0010 TF960 9.6±0.19 0.0012 TF1020 10.2±0.2 0.0012 TF1600 16.0±0.4 0.0014 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (Dielectric thickness or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm PCB size: ≤240mm X 240mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications TF high-frequency PCBs are utilized in applications of microwave and millimeter-wave domains, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.

Introduction Wangling’s F4BTM series laminates are fiberglass cloth, nano-ceramic fillers, and PTFE resin, followed by strict pressing processes. They are based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.   F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.   Features F4BTM offers a wide range of features. With a DK range from 2.98 to 3.5, it provides flexibility in design. The addition of ceramics further enhances its performance, making it suitable for demanding applications. This material is available in various thicknesses and sizes, catering to different project requirements while offering cost savings. Its commercialization and suitability for large-scale production make it a highly cost-effective choice. Additionally, F4BTM exhibits radiation-resistant and low out-gassing properties, ensuring its reliability even in challenging environments.   PCB Capability Our PCB manufacturing capabilities cover a wide range of options. We can handle various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs.   For copper weight, we offer options of 1oz (35µm), and 2oz (70µm), allowing flexibility in conductivity requirements.   When it comes to dielectric thickness (or overall thickness), we provide a comprehensive selection of options ranging from 0.25mm to 12.0mm, catering to different design specifications.   The maximum PCB size we can accommodate is 400mm X 500mm, ensuring sufficient space for your project.   We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more, allowing for customization and visual distinction.   Regarding surface finish, we support several options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements.   PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz) F4BTM298 2.98±0.06 0.0018 F4BTM300 3.0±0.06 0.0018 F4BTM320 3.2±0.06 0.0020 F4BTM350 3.5±0.07 0.0025 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.   F4BTM PCBs are utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, and Power Amplifier etc.

Brief introduction RO3203 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while remaining cost-effective. As an extension of the RO3000 series, RO3203 materials stand out with their enhanced mechanical stability.   With a dielectric constant of 3.02 and a dissipation factor of 0.0016, RO3203 materials enable an extended useful frequency range beyond 40 GHz.   Features RO3203 has a thermal conductivity of 0.48 W/mK, indicating its ability to conduct heat.   The volume resistivity is 107 MΩ.cm and surface resistivity of the material is also 107 MΩ.   RO3203 exhibits a dimensional stability of 0.8 mm/m in the X and Y directions and it has a moisture absorption rate of less than 0.1%, indicating its ability to resist absorbing moisture when exposed to specific conditions.   The material has different coefficients of thermal expansion in three directions. The Z-direction coefficient is 58 ppm/℃, while the X and Y-direction coefficients are both 13 ppm/℃.   RO3203 has a Thermal Decomposition Temperature (Td) of 500℃ and a density of 2.1 gm/cm3 at 23℃.   After soldering, the material exhibits a copper peel strength of 10.2 lbs/in and a flammability rating of V-0 according to the UL 94 standard, while also being compatible with lead-free processes.   Property RO3203 Direction Units Condition Test Method Dielectric Constant,εProcess 3.02±0.04 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Dielectric Constant,εDesign 3.02 Z - 8 GHz - 40 GHz Differential Phase Length Method Dissipation Factor, tan d 0.0016 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Conductivity 0.48   W/mK Float 100℃ ASTM C518 Volume Resistivity 107   MΩ.cm A ASTM D257 Surface Resistivity 107   MΩ A ASTM D257 Dimensional Stability 0.8 X, Y mm/m COND A IPC-TM-650 2.4.3.9 Moisure Absorption